KR960006385U - 디바이스 리드 절곡장치 - Google Patents

디바이스 리드 절곡장치

Info

Publication number
KR960006385U
KR960006385U KR2019940019428U KR19940019428U KR960006385U KR 960006385 U KR960006385 U KR 960006385U KR 2019940019428 U KR2019940019428 U KR 2019940019428U KR 19940019428 U KR19940019428 U KR 19940019428U KR 960006385 U KR960006385 U KR 960006385U
Authority
KR
South Korea
Prior art keywords
lead bending
bending device
device lead
lead
bending
Prior art date
Application number
KR2019940019428U
Other languages
English (en)
Other versions
KR200159485Y1 (ko
Inventor
양성연
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940019428U priority Critical patent/KR200159485Y1/ko
Publication of KR960006385U publication Critical patent/KR960006385U/ko
Application granted granted Critical
Publication of KR200159485Y1 publication Critical patent/KR200159485Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
KR2019940019428U 1994-07-30 1994-07-30 디바이스 리드 절곡장치 KR200159485Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940019428U KR200159485Y1 (ko) 1994-07-30 1994-07-30 디바이스 리드 절곡장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940019428U KR200159485Y1 (ko) 1994-07-30 1994-07-30 디바이스 리드 절곡장치

Publications (2)

Publication Number Publication Date
KR960006385U true KR960006385U (ko) 1996-02-17
KR200159485Y1 KR200159485Y1 (ko) 1999-10-15

Family

ID=19389912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940019428U KR200159485Y1 (ko) 1994-07-30 1994-07-30 디바이스 리드 절곡장치

Country Status (1)

Country Link
KR (1) KR200159485Y1 (ko)

Also Published As

Publication number Publication date
KR200159485Y1 (ko) 1999-10-15

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Legal Events

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