KR960006378Y1 - Oxidizing protection and protective device - Google Patents
Oxidizing protection and protective device Download PDFInfo
- Publication number
- KR960006378Y1 KR960006378Y1 KR2019940003922U KR19940003922U KR960006378Y1 KR 960006378 Y1 KR960006378 Y1 KR 960006378Y1 KR 2019940003922 U KR2019940003922 U KR 2019940003922U KR 19940003922 U KR19940003922 U KR 19940003922U KR 960006378 Y1 KR960006378 Y1 KR 960006378Y1
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- metal
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- protective device
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
- C23F13/005—Anodic protection
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F2213/00—Aspects of inhibiting corrosion of metals by anodic or cathodic protection
- C23F2213/20—Constructional parts or assemblies of the anodic or cathodic protection apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F2213/00—Aspects of inhibiting corrosion of metals by anodic or cathodic protection
- C23F2213/30—Anodic or cathodic protection specially adapted for a specific object
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
내용없음.None.
Description
제1도는 본 고안의 사시도1 is a perspective view of the present invention
제2도는 본 고안의 방식기의 회로도2 is a circuit diagram of the anticorrosive device of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 방식기 2 : 배터리1: method 2: battery
3 : 도선 4 : 도선3: lead wire 4: lead wire
5 : 전극판 6 : 금속5: electrode plate 6: metal
7 : 페인트 8 : 에폭시수지7: paint 8: epoxy resin
본 고안은 금속의 산화부식방지 및 방식장치에 관한 것이다.The present invention relates to a device for preventing corrosion and corrosion of metals.
산화란 순 물질이 산소와 화합(化合)하는 것을 말하나 일반적으로는 광범위하게 전자(電子)를 뺏기는 변화 또는 이것에 수반되는 화학반응을 말할 때가 많으며,Oxidation refers to the compounding of a pure substance with oxygen, but generally refers to a change in which electrons are widely taken away or a chemical reaction accompanying it,
이를테면 금속이 산화와 화합하는 반응은 금속이 전자를 빼앗겨 양(陽)이온이 되는 현상이 중심이 되고, 생성한 금속양이온이 산소음이온과 결합해서 금속산화물이 되는 과정이라 할 수 있으며 이 방식에 의하면 이온결합을 만드는 원자 또는 원자단의 양의 전하(電荷)가 증대해서 양의 원자가 크게되는 형상(Fe2+- Fe3+등), 음전하의 감소로 음의 원자가 작게 되는 형상(CL¬- CL)은 모두가 산화라 볼 수 있다.For example, the reaction between metal oxidation and compounding is centered on the phenomenon that metal is deprived of electrons to become positive ions, and the metal cations formed are combined with oxygen anions to form metal oxides. The positive charge of the atom or group of atoms forming the ionic bond increases to increase the positive atom (such as Fe 2+ -Fe 3+ ), and the negative charge decreases due to the reduction of negative charge (CL ¬ -CL) Is all an oxidation.
또한 부식이라 함은 물질이 주위환경과 반응하여 물질자체가 변질되거나 혹은 물질의 특성이 변질되는 것이라 할 수 있으며, 이러한 부식은 수분의 존재여부에 따라 여러 가지로 나누어지며 습식은 대부분 전자이동에 의한 전기화학반응 때문에 발생하므로 전기화학적부식이라 부르며, 이 전기화학적부식이 일어나기 위해서는 다음 4가지의 조건이 만족되어야 한다.Corrosion also means that the substance reacts with the surrounding environment, or the substance itself is altered or the characteristics of the substance are altered. Such corrosion is divided into various types depending on the presence of moisture. Since it is caused by electrochemical reaction, it is called electrochemical corrosion. In order for this electrochemical corrosion to occur, the following four conditions must be satisfied.
(1) 양극(ANODE)(1) anode (ANODE)
(2) 음극(CATHODE)(2) Cathode (CATHODE)
(3) 전류경로(ELECTRONIC PATH) 또는 금속경로(METALLIC PATH)(3) ELECTRONIC PATH or METALIC PATH
(4) 이온경로(LONIC) 또는 전해질(ELECTROIYTE)(4) ion channel (LONIC) or electrolyte (ELECTROIYTE)
이상과 같은 조건이 만족되는 음극-전류경로-양극-이온경로를 따라 전류의 흐름이 생기며 다음과 같이 양극반응과 음극반응에 의해 양극에서 부식이 일어난다.The current flows along the cathode-current path-anode-ion path where the above conditions are satisfied, and corrosion occurs at the anode by the anode reaction and the cathode reaction as follows.
가. 양극반응end. Anode reaction
양극반응을 다른 말로 산화반응이라 부르며 금속이 금속이온과 전자로 나누어지는 반응이다.The anodic reaction, in other words, the oxidation reaction, is a reaction in which a metal is divided into metal ions and electrons.
M → M+n+ neM → M + n + ne
(금속) (금속이온) (전자)(Metal) (metal ion) (electronic)
나. 음극반응은 다른 말로 환원반응이라 부르며 양극에서 전류경로를 따라 이동해온 전자가 전해질내의 양이온등과 반응하는 것을 말하며 다음과 같이 반응을 한다.I. Cathode reaction, in other words called reduction reaction, refers to the reaction of electrons moving along the current path at the anode with cations in the electrolyte.
(1) 산소환원반응(산성전해질)(1) Oxygen reduction reaction (acid electrolyte)
O2+ 4H++ 4e → 2H2OO 2 + 4 H + + 4e → 2H 2 O
(2) 수소가스 발생반응(2) Hydrogen gas generation reaction
2H++ 2e → H2 2H + + 2e → H 2
(3) 금속이온 환원반응(3) metal ion reduction reaction
FE+3+ e → Fe+2 FE +3 + e → Fe +2
(4) 금속환원반응(4) metal reduction reaction
Du+2+ 2e → CuDu +2 + 2e → Cu
이를 종합해보면 수용액내의 철의 경우, 양극과 음극의 전위차에 의해 양극과 음극 사이의 전류경로를 따라 양극에 음극으로 전자가 이동한다.In summary, in the case of iron in the aqueous solution, electrons move from the anode to the cathode along the current path between the anode and the cathode due to the potential difference between the anode and the cathode.
이때 양극에서는 전자를 방출하고 나서 양으로 대전된 철원자가 남아 전해액 내의 염기(OH¬)와 결합하여 수산화제1철(Fe(OH)2)을 형성한 녹으로 진행된다.At this time, the anode discharges electrons and then positively charged iron atoms remain and proceed with rust in which ferrous hydroxide (Fe (OH) 2 ) is formed by combining with a base (OH ¬ ) in the electrolyte.
즉, 전류가 전해질로 유출되는 부분에서 부식이 발생하게 된다.That is, corrosion occurs at the portion where the current flows out into the electrolyte.
한편, 부식의 진행을 억제하는 것을 방식이라하여 금속의 부식은 금속표면에서 전해질을 통하여 전류가 유출되는 부분에 발생하므로 전해질을 통하여 금속표면에 직류전류(방식전류)를 유입시켜 주면 표면에서는 음극반응이 일어나므로 부식이 방지된다.On the other hand, since the corrosion is suppressed, the corrosion of metal occurs in the part where the current flows out through the electrolyte on the metal surface. This happens so that corrosion is prevented.
이를 특별히 음극방식(CHTHODIC PROTECTION)이라 한다.This is specifically called CHTHODIC PROTECTION.
본 고안은 상기의 원리에 부합되는 매우 합리적인 구조의 금속의 산화부식방지 및 방식장치를 안출하게 된것인데, 이를 첨부도면에 의하여 상세히 설명하면 다음과 같다.The present invention is to devise a corrosion prevention and corrosion prevention device of a metal of a very reasonable structure in accordance with the above principle, described in detail by the accompanying drawings as follows.
방식기(1)를 배터리(2)의 플러스단자와 도선(3)으로 연결하고, 방식기(1)의 도선(4)에는 여러개의 전극판(5)을 연결하여 전극판(5)을 페인트(7)가 칠해질 금속(6)면에 부착한 후 전극판(5)의 외면을 에폭시수지(8)로 피막시켜서 된 것이다.Connect the anticorrosive device 1 to the positive terminal of the battery 2 with the lead wires 3, and connect the electrode plates 5 to the lead wires 4 of the anticorrosive device 1 to paint the electrode plate 5. After (7) was attached to the metal 6 surface to be painted, the outer surface of the electrode plate 5 was coated with an epoxy resin 8.
이와 같은 본 고안은 금속으로 된 자동전자콘트롤박스나 정밀기계박스등 금속판에 부착하여 산화부식이 되지 않도록 방식하게 되는 것으로서, 전극판(5)에 의하여 금속에는 흐르는 전류가 흐르게되며,The present invention is attached to a metal plate such as an automatic electronic control box or a precision mechanical box made of metal so as not to be oxidized and corroded, and a current flowing through the metal flows through the electrode plate 5.
이에 금속에 양이온이 발생시에는 방식기(1)에 의하여 음이온으로 바뀌게 되고, 금속에 음이온이 발생시에는 방식기(1)에 의하여 자동적으로 양이온으로 바뀌는 작용에 의하여 양호한 방식작용이 이루어지게 되어 산화부식이 방지됨으로 금속의 수명을 오래시킬 수 있는 효과가 있다.Accordingly, when cations are generated in the metal, the corrosion is changed to anions by the corrosion preventer (1), and when anions are generated in the metal, the corrosion protection is improved by the effect of automatically changing to cations by the corrosion protector (1). This prevents the long life of the metal.
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR2019940003922U KR960006378Y1 (en) | 1994-02-28 | 1994-02-28 | Oxidizing protection and protective device |
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KR2019940003922U KR960006378Y1 (en) | 1994-02-28 | 1994-02-28 | Oxidizing protection and protective device |
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KR950025026U KR950025026U (en) | 1995-09-15 |
KR960006378Y1 true KR960006378Y1 (en) | 1996-07-24 |
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KR2019940003922U KR960006378Y1 (en) | 1994-02-28 | 1994-02-28 | Oxidizing protection and protective device |
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KR (1) | KR960006378Y1 (en) |
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- 1994-02-28 KR KR2019940003922U patent/KR960006378Y1/en not_active IP Right Cessation
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