KR950031509A - Heat-resistant conductive plastic sheets and containers - Google Patents

Heat-resistant conductive plastic sheets and containers Download PDF

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Publication number
KR950031509A
KR950031509A KR1019940011207A KR19940011207A KR950031509A KR 950031509 A KR950031509 A KR 950031509A KR 1019940011207 A KR1019940011207 A KR 1019940011207A KR 19940011207 A KR19940011207 A KR 19940011207A KR 950031509 A KR950031509 A KR 950031509A
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KR
South Korea
Prior art keywords
electrically conductive
plastic sheet
heat
weight
sheet according
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KR1019940011207A
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Korean (ko)
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KR100272060B1 (en
Inventor
다께시 미야까와
미끼오 시미즈
마사미 이노우에
다다아끼 히로오까
Original Assignee
시무라 분이찌로
덴끼 가가꾸 고오교 가부시끼가이샤
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Priority to KR1019940011207A priority Critical patent/KR100272060B1/en
Publication of KR950031509A publication Critical patent/KR950031509A/en
Application granted granted Critical
Publication of KR100272060B1 publication Critical patent/KR100272060B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2313/00—Elements other than metals
    • B32B2313/04—Carbon

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

(1) 32~94중량%의 폴리페닐렌 에테르 수지, 4~61중량%의 고-충격 폴리스티렌 수지 및 2~17중량%의 폴리올레핀 수지를 함유하는 기재 수지 조성물의 기재층 A 및 (2) 10~85중량%의 PPE, 8~82중량%의 HI 및 3~33중량%의 전기 전도성-부여 물질을 함유하고, 공압출성형법으로 기재층 A의 일면 또는 양면에 적분 적층된 전기 전도성 수지 조성물의 전기 전도층 B를 함유한 내열 전기 전도성플라스틱 시트.(1) Substrate layers A and (2) 10 of the base resin composition containing 32 to 94% by weight polyphenylene ether resin, 4 to 61% by weight high-impact polystyrene resin and 2 to 17% by weight polyolefin resin. Of the electrically conductive resin composition containing -85% by weight of PPE, 8-82% by weight of HI and 3-33% by weight of an electrically conductive-imparting material, and integrally laminated on one or both sides of the base layer A by coextrusion. Heat-resistant electrically conductive plastic sheet containing an electrically conductive layer B.

Description

내열 전기전도성 플라스틱 시트 및 용기Heat-resistant conductive plastic sheets and containers

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (14)

(1) 32~94중량%의 폴리페닐렌 에테르 수지(이하에서는 간단히 PPE라고 칭함), 4~61중량%의 고-충격 폴리스티렌 수지(이하에서는 간단히 HI라고 칭함) 및 2~17중량%의 폴리올레핀 수지(이하에서는 간단히 PO라고 칭함)를 함유하는 기재 수지 조성물의 기재층 A 및 (2) 10~85중량%의 PPE, 8~82중량%의 HI 및 3~33중량%의 전기 전도성-부여 물질을 함유하고, 공압출성형법으로 기재층 A의 일면 또는 양면에 적분 적층된 전기 전도성 수지 조성물의 전기 전도층 B를 함유한 내열 전기 전도성 플라스틱 시트.(1) 32 to 94% by weight polyphenylene ether resin (hereinafter simply referred to as PPE), 4 to 61% by weight high-impact polystyrene resin (hereinafter simply referred to as HI) and 2 to 17% by weight polyolefin Substrate layer A and (2) 10-85% by weight of PPE, 8-82% by weight of HI and 3-33% by weight of an electrically conductive-granting material of a base resin composition containing a resin (hereinafter simply referred to as PO) And an electrically conductive layer B of an electrically conductive resin composition integrally laminated on one or both surfaces of the substrate layer A by a coextrusion molding method. 제1항에 있어서, a-40≤b≤a-5(식중, a는 기재층 A에서 PPE의 함량(중량%)이고, b는 기재층 A의 일면 또는 양면상 전기전도층 B에서 PPE의 함량(중량%)이다)임을 특징으로 하는 내열 전기전도성 플라스틱 시트.The method of claim 1, wherein a-40 ≦ b ≦ a-5, wherein a is the content (wt%) of PPE in the base layer A, and b is the PPE in one or both sides of the conductive layer B of the base layer A. Content (% by weight) of the heat-resistant electrically conductive plastic sheet. 제1항에 있어서, 기재층 A가 PPE, HI 및 PO세 성분 전량의 100중량부당 충진재 0.1~10중량부를 함유함을 특징으로하는 내열 전기전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 1, wherein the base layer A contains 0.1 to 10 parts by weight of the filler per 100 parts by weight of the total amount of the PPE, HI, and PO components. 제1항에 있어서, 폴리올레핀 수지가 폴리에틸렌 공중합 수지임을 특징으로하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 1, wherein the polyolefin resin is a polyethylene copolymer resin. 제1항에 있어서, 전기전도성 - 부여 물질이 카본 블랙임을 특징으로 하는 내열 전기전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 1, wherein the electrically conductive-imparting material is carbon black. 제1항에 있어서, 플라스틱 시트의 전체 두께가 0.1-5.0mm이고, 전기전도층 B의 두께는 플라스틱 시트 전체 두께의 2~70%임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 1, wherein the total thickness of the plastic sheet is 0.1-5.0 mm, and the thickness of the conductive layer B is 2 to 70% of the total thickness of the plastic sheet. 제1항에 있어서, 전기전도판 B의 표면저항이 1010Ω이상임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 1, wherein the surface resistance of the electrically conductive plate B is 10 10 Ω or more. 제1항에서 정의된 플라스틱 시트를 열형성하여 제조됨을 특징으로 하는 반도체 집적 회로용 포장 용기.A packaging container for a semiconductor integrated circuit, which is prepared by thermoforming a plastic sheet as defined in claim 1. 제3항에서, 충진재가 카본 블랙임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.4. The heat-resistant electrically conductive plastic sheet according to claim 3, wherein the filler is carbon black. 제4항에 있어서, 폴리에틸렌 공중합 수지가 에틸렌-α-올레핀 공중합 수지 및/또는 에틸렌-유기산 에스테르 공중합 수지임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 4, wherein the polyethylene copolymer resin is an ethylene-α-olefin copolymer resin and / or an ethylene-organic acid ester copolymer resin. 제5항에 있어서, 카본 블랙이 98%이상의 탄소 순도 및 1.5%이하의 휘발성 함량을 가지는 것임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.6. The heat resistant electrically conductive plastic sheet according to claim 5, wherein the carbon black has a carbon purity of 98% or more and a volatile content of 1.5% or less. 제8항에 따른 반도체 집적 회로용 포장 용기가 담체 테이프임을 특징으로 하는 포장용기.A packaging container according to claim 8, wherein the packaging container for semiconductor integrated circuits is a carrier tape. 제10항에 있어서, 에틸렌-α-올레핀 공중합 수지가 에틸렌-1-부텐 공중합 수지임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 10, wherein the ethylene-α-olefin copolymer resin is an ethylene-1-butene copolymer resin. 제10항에 있어서, 에틸렌-유기산 에스테르 공중합 수지가 에틸렌-비닐 아세테이트 공중합 수지 및/또는 에틸렌-아크릴산 에스테르 공중합 수지임을 특징으로 하는 내열 전기 전도성 플라스틱 시트.The heat-resistant electrically conductive plastic sheet according to claim 10, wherein the ethylene-organic acid ester copolymer resin is ethylene-vinyl acetate copolymer resin and / or ethylene-acrylic acid ester copolymer resin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940011207A 1994-05-23 1994-05-23 Heat resistance electrically conductive plastic sheet and container KR100272060B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940011207A KR100272060B1 (en) 1994-05-23 1994-05-23 Heat resistance electrically conductive plastic sheet and container

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KR1019940011207A KR100272060B1 (en) 1994-05-23 1994-05-23 Heat resistance electrically conductive plastic sheet and container

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KR950031509A true KR950031509A (en) 1995-12-18
KR100272060B1 KR100272060B1 (en) 2000-12-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7505071B2 (en) 2004-05-11 2009-03-17 Samsung Electronics Co., Ltd. Horizontal charge coupled device driving circuit with reduced power consumption, solid-state image-sensing device having the same, and driving method of the solid-state image-sensing device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101476912B1 (en) * 2013-06-27 2014-12-29 롯데케미칼 주식회사 Conductive expandable resin composition having modified polyphenylene ether and manufacturing method same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7505071B2 (en) 2004-05-11 2009-03-17 Samsung Electronics Co., Ltd. Horizontal charge coupled device driving circuit with reduced power consumption, solid-state image-sensing device having the same, and driving method of the solid-state image-sensing device

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