KR950028087A - Heat sink surface structure for semiconductor - Google Patents

Heat sink surface structure for semiconductor Download PDF

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Publication number
KR950028087A
KR950028087A KR1019940005967A KR19940005967A KR950028087A KR 950028087 A KR950028087 A KR 950028087A KR 1019940005967 A KR1019940005967 A KR 1019940005967A KR 19940005967 A KR19940005967 A KR 19940005967A KR 950028087 A KR950028087 A KR 950028087A
Authority
KR
South Korea
Prior art keywords
heat sink
package
semiconductor
surface structure
long time
Prior art date
Application number
KR1019940005967A
Other languages
Korean (ko)
Other versions
KR970010673B1 (en
Inventor
이상덕
Original Assignee
황인길
아남산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 황인길, 아남산업 주식회사 filed Critical 황인길
Priority to KR1019940005967A priority Critical patent/KR970010673B1/en
Publication of KR950028087A publication Critical patent/KR950028087A/en
Application granted granted Critical
Publication of KR970010673B1 publication Critical patent/KR970010673B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 반도체용 방열판 표면구조에 관한 것으로서, 반도체의 패키지(7)에 내장되는 방열관(1)의 외표면(2) 전체를 식각처리 또는 샌드브라스트 처리하여 미세한 요철(凹凸)돌기(3)를 형성하므로서 표면(2)에 인쇄되는 기호 및 문자등의 표시상태를 오래 유지한 수 있도록 하고, 패키지(7)와의 점착력을 높이도록 한 것으로서, 기호 및 인쇄문자의 도형을 영구성 시험시 지워짐이나 떨어지는 것을 방지하여 표시상태를 장기간 유지할 수 있도록 하고 패키지 몰딩에 의해 점착된 방열판과 패키지와의 접착력을 높여 반도체 제품의 클랙을 방지하여 제품의 품질을 향상시킨 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface structure of a heat sink for semiconductors, wherein the entire outer surface (2) of the heat dissipation pipe (1) embedded in the package (7) of the semiconductor is subjected to etching or sand blasting to finely uneven projections (3 ) To maintain the display state of symbols and characters printed on the surface (2) for a long time, and to increase the adhesive force with the package (7), and to erase the figures of symbols and printed characters during the permanence test. It prevents falling and keeps the display state for a long time and improves the quality of the product by preventing the crack of the semiconductor product by increasing the adhesion between the heat sink and the package adhered by the package molding.

Description

반도체용 방열판 표면구조Heat sink surface structure for semiconductor

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 방열판이 반도체에 조립된 상태도,1 is a state in which the heat sink of the present invention is assembled to a semiconductor,

제2도는 본 발명의 방열판이 설치된 상태의 구성도,2 is a configuration diagram in a state where the heat sink of the present invention is installed

제3도는 제2도의 "A"부 및 'B"부 확대도.3 is an enlarged view of part "A" and part "B" of FIG.

Claims (3)

반도체의 패키지(7)에 내장되는 방열판(1)의 외표면(2) 전체를 식각처리 또는 샌드브라스트 처리하여 미세한 요철(凹凸)돌기(3)를 형성하므로서 표면(2)에 인쇄되는 기호 및 문자등의 표시상태를 오래 유지할 수 있도록하고, 패키지(7)와의 점착력을 향상시킨 것을 특징으로 하는 반도체용 방열판 표면구조.Symbols printed on the surface 2 by forming the fine uneven protrusions 3 by etching or sandblasting the entire outer surface 2 of the heat sink 1 embedded in the semiconductor package 7 and A heat dissipation surface structure for a semiconductor, characterized in that the display state of characters and the like can be maintained for a long time, and the adhesion with the package 7 is improved. 제1항에 있어서, 상기 방열판(1)의 표면(2) 거칠기 요철을 0.3-100㎛로 한 것을 특징으로 하는 반도체용 방열판 표면구조.The surface structure of a heat sink for semiconductors according to claim 1, wherein the surface (2) roughness of the heat sink (1) is set to 0.3 to 100 m. 제1항에 있어서, 상기 방열판(1)의 표면(2)을 거칠게 도금하여 된 것을 특징으로 하는 반도체용 방열판 표면구조.The surface structure of a heat sink for semiconductors according to claim 1, wherein the surface (2) of the heat sink (1) is roughly plated. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019940005967A 1994-03-24 1994-03-24 Heat sink surface structure of a semiconductor KR970010673B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940005967A KR970010673B1 (en) 1994-03-24 1994-03-24 Heat sink surface structure of a semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940005967A KR970010673B1 (en) 1994-03-24 1994-03-24 Heat sink surface structure of a semiconductor

Publications (2)

Publication Number Publication Date
KR950028087A true KR950028087A (en) 1995-10-18
KR970010673B1 KR970010673B1 (en) 1997-06-30

Family

ID=19379536

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940005967A KR970010673B1 (en) 1994-03-24 1994-03-24 Heat sink surface structure of a semiconductor

Country Status (1)

Country Link
KR (1) KR970010673B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990035568A (en) * 1997-10-31 1999-05-15 윤종용 package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006222406A (en) 2004-08-06 2006-08-24 Denso Corp Semiconductor device
JP4764159B2 (en) * 2005-12-20 2011-08-31 富士通セミコンダクター株式会社 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990035568A (en) * 1997-10-31 1999-05-15 윤종용 package

Also Published As

Publication number Publication date
KR970010673B1 (en) 1997-06-30

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