KR950025909U - 레이저 리페어 시스템 - Google Patents
레이저 리페어 시스템Info
- Publication number
- KR950025909U KR950025909U KR2019940002344U KR19940002344U KR950025909U KR 950025909 U KR950025909 U KR 950025909U KR 2019940002344 U KR2019940002344 U KR 2019940002344U KR 19940002344 U KR19940002344 U KR 19940002344U KR 950025909 U KR950025909 U KR 950025909U
- Authority
- KR
- South Korea
- Prior art keywords
- repair system
- laser repair
- laser
- repair
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940002344U KR200165868Y1 (ko) | 1994-02-07 | 1994-02-07 | 레이저 리페어 시스템 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940002344U KR200165868Y1 (ko) | 1994-02-07 | 1994-02-07 | 레이저 리페어 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950025909U true KR950025909U (ko) | 1995-09-18 |
KR200165868Y1 KR200165868Y1 (ko) | 2000-01-15 |
Family
ID=19377002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940002344U KR200165868Y1 (ko) | 1994-02-07 | 1994-02-07 | 레이저 리페어 시스템 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200165868Y1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100598091B1 (ko) * | 1999-10-29 | 2006-07-07 | 삼성전자주식회사 | 웨이퍼 척을 갖는 웨이퍼 수리 시스템 |
-
1994
- 1994-02-07 KR KR2019940002344U patent/KR200165868Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200165868Y1 (ko) | 2000-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20050922 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |