KR950025909U - 레이저 리페어 시스템 - Google Patents

레이저 리페어 시스템

Info

Publication number
KR950025909U
KR950025909U KR2019940002344U KR19940002344U KR950025909U KR 950025909 U KR950025909 U KR 950025909U KR 2019940002344 U KR2019940002344 U KR 2019940002344U KR 19940002344 U KR19940002344 U KR 19940002344U KR 950025909 U KR950025909 U KR 950025909U
Authority
KR
South Korea
Prior art keywords
repair system
laser repair
laser
repair
Prior art date
Application number
KR2019940002344U
Other languages
English (en)
Other versions
KR200165868Y1 (ko
Inventor
정윤모
김영삼
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019940002344U priority Critical patent/KR200165868Y1/ko
Publication of KR950025909U publication Critical patent/KR950025909U/ko
Application granted granted Critical
Publication of KR200165868Y1 publication Critical patent/KR200165868Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR2019940002344U 1994-02-07 1994-02-07 레이저 리페어 시스템 KR200165868Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940002344U KR200165868Y1 (ko) 1994-02-07 1994-02-07 레이저 리페어 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940002344U KR200165868Y1 (ko) 1994-02-07 1994-02-07 레이저 리페어 시스템

Publications (2)

Publication Number Publication Date
KR950025909U true KR950025909U (ko) 1995-09-18
KR200165868Y1 KR200165868Y1 (ko) 2000-01-15

Family

ID=19377002

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940002344U KR200165868Y1 (ko) 1994-02-07 1994-02-07 레이저 리페어 시스템

Country Status (1)

Country Link
KR (1) KR200165868Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100598091B1 (ko) * 1999-10-29 2006-07-07 삼성전자주식회사 웨이퍼 척을 갖는 웨이퍼 수리 시스템

Also Published As

Publication number Publication date
KR200165868Y1 (ko) 2000-01-15

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Legal Events

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A201 Request for examination
E701 Decision to grant or registration of patent right
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Payment date: 20050922

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