KR950021434U - Probe card for package testing - Google Patents

Probe card for package testing

Info

Publication number
KR950021434U
KR950021434U KR2019930028386U KR930028386U KR950021434U KR 950021434 U KR950021434 U KR 950021434U KR 2019930028386 U KR2019930028386 U KR 2019930028386U KR 930028386 U KR930028386 U KR 930028386U KR 950021434 U KR950021434 U KR 950021434U
Authority
KR
South Korea
Prior art keywords
probe card
package testing
package
testing
probe
Prior art date
Application number
KR2019930028386U
Other languages
Korean (ko)
Other versions
KR970006518Y1 (en
Inventor
한정훈
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930028386U priority Critical patent/KR970006518Y1/en
Publication of KR950021434U publication Critical patent/KR950021434U/en
Application granted granted Critical
Publication of KR970006518Y1 publication Critical patent/KR970006518Y1/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR2019930028386U 1993-12-17 1993-12-17 Probe card of package test KR970006518Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930028386U KR970006518Y1 (en) 1993-12-17 1993-12-17 Probe card of package test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930028386U KR970006518Y1 (en) 1993-12-17 1993-12-17 Probe card of package test

Publications (2)

Publication Number Publication Date
KR950021434U true KR950021434U (en) 1995-07-28
KR970006518Y1 KR970006518Y1 (en) 1997-06-25

Family

ID=19371590

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930028386U KR970006518Y1 (en) 1993-12-17 1993-12-17 Probe card of package test

Country Status (1)

Country Link
KR (1) KR970006518Y1 (en)

Also Published As

Publication number Publication date
KR970006518Y1 (en) 1997-06-25

Similar Documents

Publication Publication Date Title
DE69228369D1 (en) Non-contact test probe
DE69326808D1 (en) Test device for containers
NO931430L (en) Measuring device
DE69518074D1 (en) TESTING PACKAGING
DE69404228D1 (en) Connector device for IC packages
DE69025110D1 (en) Test device
DE19782246T1 (en) IC test device
FI954443A0 (en) Strength Testing Device
DE69605757D1 (en) IC test device
DE69402434D1 (en) Test device for banknotes
NO941247L (en) probe device
NO960149D0 (en) test Device
DE69428287D1 (en) MEASURING DEVICE
NO180316C (en) Device for dimension measurement
FI931411A0 (en) TESTING DEVICES FOR BROMSSYSTEM
KR950021434U (en) Probe card for package testing
NO942034D0 (en) Test apparatus
DE59407860D1 (en) Tester
KR950021433U (en) Probe Card for Wafer Test
KR950021436U (en) Probe card for wafer testing
KR960025392U (en) Probe Cards for Wafer Testing
KR950021440U (en) Probe card device for semiconductor device measurement
DE69302684D1 (en) Test device
DE69416728D1 (en) Test device
KR970019119U (en) Burn-in board for testing multiple packages

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20041101

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee