KR950015656U - Solder for semiconductor assembly - Google Patents

Solder for semiconductor assembly

Info

Publication number
KR950015656U
KR950015656U KR2019930023278U KR930023278U KR950015656U KR 950015656 U KR950015656 U KR 950015656U KR 2019930023278 U KR2019930023278 U KR 2019930023278U KR 930023278 U KR930023278 U KR 930023278U KR 950015656 U KR950015656 U KR 950015656U
Authority
KR
South Korea
Prior art keywords
solder
semiconductor assembly
semiconductor
assembly
Prior art date
Application number
KR2019930023278U
Other languages
Korean (ko)
Other versions
KR200164430Y1 (en
Inventor
김대영
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019930023278U priority Critical patent/KR200164430Y1/en
Publication of KR950015656U publication Critical patent/KR950015656U/en
Application granted granted Critical
Publication of KR200164430Y1 publication Critical patent/KR200164430Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR2019930023278U 1993-11-08 1993-11-08 Solder for semiconductor assembling KR200164430Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930023278U KR200164430Y1 (en) 1993-11-08 1993-11-08 Solder for semiconductor assembling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930023278U KR200164430Y1 (en) 1993-11-08 1993-11-08 Solder for semiconductor assembling

Publications (2)

Publication Number Publication Date
KR950015656U true KR950015656U (en) 1995-06-19
KR200164430Y1 KR200164430Y1 (en) 2000-01-15

Family

ID=19367297

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930023278U KR200164430Y1 (en) 1993-11-08 1993-11-08 Solder for semiconductor assembling

Country Status (1)

Country Link
KR (1) KR200164430Y1 (en)

Also Published As

Publication number Publication date
KR200164430Y1 (en) 2000-01-15

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20070914

Year of fee payment: 9

EXPY Expiration of term