KR950010201U - Double head nozzle assembly for spraying coating liquid of semiconductor coating equipment - Google Patents

Double head nozzle assembly for spraying coating liquid of semiconductor coating equipment

Info

Publication number
KR950010201U
KR950010201U KR2019930017866U KR930017866U KR950010201U KR 950010201 U KR950010201 U KR 950010201U KR 2019930017866 U KR2019930017866 U KR 2019930017866U KR 930017866 U KR930017866 U KR 930017866U KR 950010201 U KR950010201 U KR 950010201U
Authority
KR
South Korea
Prior art keywords
nozzle assembly
head nozzle
double head
coating liquid
semiconductor
Prior art date
Application number
KR2019930017866U
Other languages
Korean (ko)
Other versions
KR960008671Y1 (en
Inventor
안찬호
이정원
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930017866U priority Critical patent/KR960008671Y1/en
Publication of KR950010201U publication Critical patent/KR950010201U/en
Application granted granted Critical
Publication of KR960008671Y1 publication Critical patent/KR960008671Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
KR2019930017866U 1993-09-08 1993-09-08 Double head nozzle assembly for coating material of semiconductor coater KR960008671Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930017866U KR960008671Y1 (en) 1993-09-08 1993-09-08 Double head nozzle assembly for coating material of semiconductor coater

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930017866U KR960008671Y1 (en) 1993-09-08 1993-09-08 Double head nozzle assembly for coating material of semiconductor coater

Publications (2)

Publication Number Publication Date
KR950010201U true KR950010201U (en) 1995-04-24
KR960008671Y1 KR960008671Y1 (en) 1996-10-07

Family

ID=19363017

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930017866U KR960008671Y1 (en) 1993-09-08 1993-09-08 Double head nozzle assembly for coating material of semiconductor coater

Country Status (1)

Country Link
KR (1) KR960008671Y1 (en)

Also Published As

Publication number Publication date
KR960008671Y1 (en) 1996-10-07

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040920

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee