KR950008233Y1 - Heat sink for electric and electronic equipment - Google Patents

Heat sink for electric and electronic equipment Download PDF

Info

Publication number
KR950008233Y1
KR950008233Y1 KR2019930000065U KR930000065U KR950008233Y1 KR 950008233 Y1 KR950008233 Y1 KR 950008233Y1 KR 2019930000065 U KR2019930000065 U KR 2019930000065U KR 930000065 U KR930000065 U KR 930000065U KR 950008233 Y1 KR950008233 Y1 KR 950008233Y1
Authority
KR
South Korea
Prior art keywords
heat sink
electronic device
electromagnetic waves
capacitor
circuit board
Prior art date
Application number
KR2019930000065U
Other languages
Korean (ko)
Other versions
KR940019869U (en
Inventor
고진신
Original Assignee
삼성전자 주식회사
정용문
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사, 정용문 filed Critical 삼성전자 주식회사
Priority to KR2019930000065U priority Critical patent/KR950008233Y1/en
Publication of KR940019869U publication Critical patent/KR940019869U/en
Application granted granted Critical
Publication of KR950008233Y1 publication Critical patent/KR950008233Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Abstract

내용 없음.No content.

Description

전자기기용 방열판Heat sink for electronic device

제1도는 본 고안에 따른 전자기기용 방열판을 도시한 사시도.1 is a perspective view showing a heat sink for an electronic device according to the present invention.

제2도 내지 제3도는 방열판에 케페시터를 장착하지 않았을 경우 전자파의 발생상태를 도시한 그래프.2 to 3 are graphs showing the generation of electromagnetic waves when a capacitor is not mounted on the heat sink.

제4도 내지 제5도는 본 고안에 따른 전자기기용 방열판에 케페시터를 장착하였을 경우 전자파의 발생상태를 도시한 그래프.4 to 5 are graphs showing the state of generation of electromagnetic waves when a capacitor is mounted on the heat sink for an electronic device according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

20 : 방열판 30 : 캐패시터20: heat sink 30: capacitor

40 : 전자부품40: electronic component

본 고안은 전자기기용 방열판에 관한 것으로, 더 상세하게는 전자기기의 부품으로 부터 방출되는 전자파를 흡수할 수 있도록 된 전자기기용 방열판에 관한 것이다.The present invention relates to a heat sink for an electronic device, and more particularly, to a heat sink for an electronic device that can absorb the electromagnetic waves emitted from the components of the electronic device.

통상적으로 컴퓨터, 텔레비젼등 각종 전자기기는 이의 회로기판에 설치되는 복수의 부품으로 부터 인체에 유해한 전자파가 발생되게 되는데, 종래에는 이러한 전자파를 흡수 및 제거하기 위하여 많은 연구가 진행되어 왔다. 이러한 전자파를 흡수하기위한 장치로는 컴퓨터용 모니터의 전면에 전자파를 흡수하기 위한 필터를 설치하거나 전자기기의 케이스 내면에 전자파를 흡수할 수 있는 물질을 도포한 것이 있으나 이들은 케이스의 내외부에 별도로 설치하거나 도포하여야 하므로 이에 따른 많은 작업공수와 비용이 소요되게 되는 문제점이 있었다.In general, various electronic devices such as computers and televisions generate electromagnetic waves harmful to a human body from a plurality of components installed on circuit boards thereof. In the past, many studies have been conducted to absorb and remove such electromagnetic waves. As a device for absorbing electromagnetic waves, a filter for absorbing electromagnetic waves is installed on the front of a computer monitor, or a material for absorbing electromagnetic waves is applied to the inner surface of the case of an electronic device. Since there is a need to apply a lot of labor and costs accordingly there was a problem.

이와 같은 문제점을 해결하기 위하여 본 발명인은 전자기기로부터 발생되는 전자파에 대해 연구하는 과정에서 제1도에 도시된 바와 같이 회로기판에 고정설치된 방열판이 회로기판으로 부터 방출되는 전자파가 충진되어 캐페시터 성분이 존재한다는 것을 알 수 있었다. 이와 같이 방열판이 캐퍼시터 역할를 하게 되므로 전자파가 축적되어 전자파 발생실험시 매우 큰 노이즈원으로 작용하게 되는 문제점이 내재되어 있었다.In order to solve the above problems, the inventors of the present invention, in the course of studying the electromagnetic waves generated from the electronic device is filled with the electromagnetic wave emitted from the circuit board heat sink is fixed to the circuit board as shown in FIG. I knew it existed. Thus, since the heat sink acts as a capacitor, there is a problem in that electromagnetic waves are accumulated and act as a very large noise source during the electromagnetic wave generation experiment.

따라서 본 고안은 회로기판에 설치된 전자부품으로 부터 발생되는 전자파를 흡수할 수 있도록 된 전자기기용 방열판을 제공함에 그 목적이 있다.Accordingly, an object of the present invention is to provide a heat sink for an electronic device capable of absorbing electromagnetic waves generated from electronic components installed on a circuit board.

본 고안의 다른 목적은 전자기기로 부터 방출되는 전자파기 축적됨으로써 전자파 발생실험시 노이즈원으로 작용하는 것을 방지할 수 있도록 된 전자기기용 방열판을 제공함에 있다.Another object of the present invention is to provide a heat sink for an electronic device which can prevent the electromagnetic wave from being discharged from the electronic device to be prevented from acting as a noise source during the electromagnetic wave generation experiment.

상기 목적을 달성하기 위하여 본 고안은 복수의 전자 부품이 고정설치되는 판상의 본체를 구비하여 된 전자기기용 방열판에 있어서, 상기 본체에 회로기판상의 단자와 접지되는 케패시터를 설치하여 된 것을 그 특징으로 한다.In order to achieve the above object, the present invention is a heat dissipation plate for an electronic device provided with a plate-shaped body in which a plurality of electronic components are fixed and installed, wherein the capacitor is provided with a terminal on the circuit board and grounded. do.

이하 첨부된 도면을 참조하여 본 고안에 따른 한 바람직한 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, a preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

제1도에는 본 고안에 따른 전자기기용 방열판(20)이 도시되어 있는 바, 이는 전자기기의 회로기판에 설치된 판상의 본체(21)의 표면에 다수의 전자부품(40)이 고정설치되는데, 이 방열판(20)은 본 고안의 특징에 따라 회로기판상에 형성된 적어도 하나의 단자와 접속되는 케패시터(30)가 설치된다. 여기에서 상기 캐패시터(30)는 로기판상이 5V 단자와 접지되는 0.1㎌의 케패시터를 사용함이 바람직하다. 그리고 상기 방열판에 축척되는 전자파의 노이즈는 방열판에 저항 또는 인덕턴스를 설치하여 제거할 수도 있다.1 shows a heat dissipation plate 20 for an electronic device according to the present invention, which is fixed to a plurality of electronic components 40 on the surface of a plate-shaped body 21 installed on a circuit board of the electronic device. The heat sink 20 is provided with a capacitor 30 that is connected to at least one terminal formed on the circuit board according to the features of the present invention. In this case, the capacitor 30 preferably uses a capacitor of 0.1 ㎌ having a ground substrate on the 5V terminal. The noise of the electromagnetic waves accumulated on the heat sink may be removed by installing a resistor or an inductance on the heat sink.

이와같이 구성된 본 고안에 따른 전자기기용 방열판의 작용을 설명하면 다음과 같다.Referring to the operation of the heat sink for an electronic device according to the present invention configured as described above are as follows.

회로기판 또는 방열판(20) 설치된 전자부품은 전자기기의 작동시 전자파가 발생되게 되는데, 이 전자파의 일부는 상기 방열판에 축적되어 전자기기로 부터 방출되는 전자파 측정시험시 노이즈 성분으로 작용하게 되는데, 본 고안에 따른 방열판(20)은 캐패시터(30)에 의해 회로기판의 단자중 약 5V가 인가되는 단자와 전기적으로 연결되어 있으므로 방열판(20)에 전자파가 축적되는 것을 방지할 수 있다.Electronic components installed on the circuit board or the heat sink 20 generate electromagnetic waves during the operation of the electronic device. A part of the electromagnetic waves accumulates on the heat sink and acts as a noise component during the electromagnetic measurement test emitted from the electronic device. Since the heat sink 20 according to the present invention is electrically connected to a terminal to which about 5 V of the terminals of the circuit board is applied by the capacitor 30, electromagnetic waves may be prevented from accumulating on the heat sink 20.

즉, 본 발명인의 실험에 의하면 제2도 및 제3도에 나타내보인 바와 같이 회로기판에 설치된 방열판에 케페시터를 연결하지았을 경우 1내지 10㎒ 영역의 협대역(narrowband)과 광대역(boradband)에서 전자파의 발생이으로 매우 높다는 것을 알수있었다.In other words, according to the experiments of the present inventors, as shown in FIGS. 2 and 3, when a capacitor is connected to a heat sink installed on a circuit board, in the narrowband and the wideband of 1 to 10 MHz region, The generation of electromagnetic waves was very high.

그러나 본 고안의 특징에 따라 방열판(20)을 캐패시터에 의해 회로기판의 단자에 접지시킨 경우에는 제4도 및 제5도의 그래프에 나타내 보인 바와 같이 1내지 10㎒영역의 협대역과 광대역에서 전자파의 발생이 종래에 비하여 상대적으로 크게 줄었다는 것을 알수 있었다.However, when the heat sink 20 is grounded to the terminal of the circuit board by a capacitor according to the characteristics of the present invention, as shown in the graphs of Figs. 4 and 5, It was found that the occurrence was relatively largely reduced compared to the conventional one.

이와 같이 본 고안 방열판은 이 방열판이 전자기기의 전자파 노이즈 원으로 작용하는 것을 근본적으로 해결할 수 있고, 전자부품을 냉각시키는 방열판이 사용되는 각종 전자기기로 부터 전자파가 방출되는 것을 극소화 할 수 있으며, 종래와 같이 전자기기에 전자부품으로 부터 방출되는 전자파를 흡수하기 위하여 별도로 전자파 흡수장치를 설치할 필요가 없고 나아가서는 전자기기의 상품적 가치를 향상시킬 수 있는 이점을 가진다.Thus, the heat sink of the present invention can fundamentally solve that the heat sink acts as an electromagnetic noise source of the electronic device, and can minimize the emission of electromagnetic waves from various electronic devices in which the heat sink for cooling the electronic components is used. As such, there is no need to install an electromagnetic wave absorber separately to absorb electromagnetic waves emitted from electronic components in the electronic device, and furthermore, the merchandise value of the electronic device can be improved.

Claims (3)

복수의 전자 부품이 고정설치되는 판상의 본체를 구비하여 된 전자기기용 방열판에 있어서, 상기 본체(21)가 회로기판상의 단자와 케패시터(30)에 의해 접지더는 것을 특징으로 하는 방열판.A heat dissipation plate for an electronic device comprising a plate-shaped main body in which a plurality of electronic components are fixed and fixed, wherein the main body (21) is grounded by a terminal on the circuit board and a capacitor (30). 제1항에 있어서, 상기 케페시티(30)가 0.1㎌인 것을 특징으로 하는 방열판.The heat sink according to claim 1, wherein the capacity is 0.1 kW. 제1항에 또는 제2항중 적어도 어느 한 항에 있어서, 상기 케패시터(30)가 회로기판상의 5v의 전압이 인가되는 단자와 접속되는 것을 특징으로 하는 방열판.The heat sink according to claim 1 or 2, wherein the capacitor (30) is connected to a terminal to which a voltage of 5v on the circuit board is applied.
KR2019930000065U 1993-01-06 1993-01-06 Heat sink for electric and electronic equipment KR950008233Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930000065U KR950008233Y1 (en) 1993-01-06 1993-01-06 Heat sink for electric and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930000065U KR950008233Y1 (en) 1993-01-06 1993-01-06 Heat sink for electric and electronic equipment

Publications (2)

Publication Number Publication Date
KR940019869U KR940019869U (en) 1994-08-22
KR950008233Y1 true KR950008233Y1 (en) 1995-10-04

Family

ID=19349360

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930000065U KR950008233Y1 (en) 1993-01-06 1993-01-06 Heat sink for electric and electronic equipment

Country Status (1)

Country Link
KR (1) KR950008233Y1 (en)

Also Published As

Publication number Publication date
KR940019869U (en) 1994-08-22

Similar Documents

Publication Publication Date Title
US6219239B1 (en) EMI reduction device and assembly
US6243265B1 (en) Processor EMI shielding
EP1130953B1 (en) Electromagnetic shield plate, electromagnetic shield structure, and entertainment device
US6310773B1 (en) Heat sink system
US6205026B1 (en) Heat sink retention components and system
US5777844A (en) Electronic control with heat sink
US7210946B2 (en) Electronic device with EMI shield
US20030067757A1 (en) Apparatus and method for shielding a device
US20020071265A1 (en) Electromagnetic shield for printed circuit boards
US5459348A (en) Heat sink and electromagnetic interference shield assembly
US6856209B2 (en) EMI suppression method for powertrain control modules
KR950008233Y1 (en) Heat sink for electric and electronic equipment
JPH0718409U (en) Printed circuit board holding mechanism with noise absorption function
US20040233596A1 (en) Electrostatic discharge protection apparatus for a circuit board
US5796584A (en) Bridge for power transistors with improved cooling
US4908735A (en) Electronic apparatus reducing generation of electro magnetic interference
US20060049490A1 (en) Displaying apparatus
US6992894B1 (en) Method and apparatus for EMI shielding
JP4063382B2 (en) Electrical equipment
KR100738348B1 (en) Electromagnetic wave shield cover for display apparatus
US5525943A (en) Electromagnetic compatibility filter utilizing inherently formed capacitance
US4730235A (en) Cascadable carrier for high power semiconductors or other electronic components
JPH0555781A (en) Shield structure for electronic device
KR200142916Y1 (en) Cooling plate for electronic device
JP2822800B2 (en) Connection method between circuit board and ground plane

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20000926

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee