KR940023535U - Gas injection device on the back of semiconductor wafer - Google Patents

Gas injection device on the back of semiconductor wafer

Info

Publication number
KR940023535U
KR940023535U KR2019930004219U KR930004219U KR940023535U KR 940023535 U KR940023535 U KR 940023535U KR 2019930004219 U KR2019930004219 U KR 2019930004219U KR 930004219 U KR930004219 U KR 930004219U KR 940023535 U KR940023535 U KR 940023535U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
injection device
gas injection
gas
wafer
Prior art date
Application number
KR2019930004219U
Other languages
Korean (ko)
Other versions
KR950009249Y1 (en
Inventor
곽병호
Original Assignee
엘지일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지일렉트론 주식회사 filed Critical 엘지일렉트론 주식회사
Priority to KR2019930004219U priority Critical patent/KR950009249Y1/en
Publication of KR940023535U publication Critical patent/KR940023535U/en
Application granted granted Critical
Publication of KR950009249Y1 publication Critical patent/KR950009249Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019930004219U 1993-03-20 1993-03-20 Semiconductor wafer back space gas injection apparatus KR950009249Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930004219U KR950009249Y1 (en) 1993-03-20 1993-03-20 Semiconductor wafer back space gas injection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930004219U KR950009249Y1 (en) 1993-03-20 1993-03-20 Semiconductor wafer back space gas injection apparatus

Publications (2)

Publication Number Publication Date
KR940023535U true KR940023535U (en) 1994-10-22
KR950009249Y1 KR950009249Y1 (en) 1995-10-23

Family

ID=19352415

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930004219U KR950009249Y1 (en) 1993-03-20 1993-03-20 Semiconductor wafer back space gas injection apparatus

Country Status (1)

Country Link
KR (1) KR950009249Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3742000B2 (en) 2000-11-30 2006-02-01 富士通株式会社 Press machine

Also Published As

Publication number Publication date
KR950009249Y1 (en) 1995-10-23

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Legal Events

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Payment date: 20070914

Year of fee payment: 13

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