KR940021339U - 성형용 콤파운드의 예열장치 - Google Patents

성형용 콤파운드의 예열장치

Info

Publication number
KR940021339U
KR940021339U KR2019930002117U KR930002117U KR940021339U KR 940021339 U KR940021339 U KR 940021339U KR 2019930002117 U KR2019930002117 U KR 2019930002117U KR 930002117 U KR930002117 U KR 930002117U KR 940021339 U KR940021339 U KR 940021339U
Authority
KR
South Korea
Prior art keywords
molding compound
preheating device
compound preheating
molding
preheating
Prior art date
Application number
KR2019930002117U
Other languages
English (en)
Other versions
KR960002550Y1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019930002117U priority Critical patent/KR960002550Y1/ko
Publication of KR940021339U publication Critical patent/KR940021339U/ko
Application granted granted Critical
Publication of KR960002550Y1 publication Critical patent/KR960002550Y1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR2019930002117U 1993-02-17 1993-02-17 성형용 콤파운드의 예열장치 KR960002550Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930002117U KR960002550Y1 (ko) 1993-02-17 1993-02-17 성형용 콤파운드의 예열장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930002117U KR960002550Y1 (ko) 1993-02-17 1993-02-17 성형용 콤파운드의 예열장치

Publications (2)

Publication Number Publication Date
KR940021339U true KR940021339U (ko) 1994-09-24
KR960002550Y1 KR960002550Y1 (ko) 1996-03-27

Family

ID=19350851

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930002117U KR960002550Y1 (ko) 1993-02-17 1993-02-17 성형용 콤파운드의 예열장치

Country Status (1)

Country Link
KR (1) KR960002550Y1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980083060A (ko) * 1997-05-12 1998-12-05 배순훈 에어커튼 냉장고의 냉기단속장치 및 그 제어방법
KR19980083065A (ko) * 1997-05-12 1998-12-05 배순훈 에어커튼 냉장고의 냉기단속방법

Also Published As

Publication number Publication date
KR960002550Y1 (ko) 1996-03-27

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Legal Events

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