KR940014993U - Chip silo - Google Patents

Chip silo

Info

Publication number
KR940014993U
KR940014993U KR2019920026282U KR920026282U KR940014993U KR 940014993 U KR940014993 U KR 940014993U KR 2019920026282 U KR2019920026282 U KR 2019920026282U KR 920026282 U KR920026282 U KR 920026282U KR 940014993 U KR940014993 U KR 940014993U
Authority
KR
South Korea
Prior art keywords
chip silo
silo
chip
Prior art date
Application number
KR2019920026282U
Other languages
Korean (ko)
Other versions
KR950009864Y1 (en
Inventor
장문석
김종해
Original Assignee
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코오롱 filed Critical 주식회사 코오롱
Priority to KR92026282U priority Critical patent/KR950009864Y1/en
Publication of KR940014993U publication Critical patent/KR940014993U/en
Application granted granted Critical
Publication of KR950009864Y1 publication Critical patent/KR950009864Y1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29BPREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00Conditioning or physical treatment of the material to be shaped
    • B29B13/02Conditioning or physical treatment of the material to be shaped by heating
    • B29B13/022Melting the material to be shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00Use of unspecified macromolecular compounds as moulding material

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
KR92026282U 1992-12-23 1992-12-23 Chip silo KR950009864Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92026282U KR950009864Y1 (en) 1992-12-23 1992-12-23 Chip silo

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92026282U KR950009864Y1 (en) 1992-12-23 1992-12-23 Chip silo

Publications (2)

Publication Number Publication Date
KR940014993U true KR940014993U (en) 1994-07-19
KR950009864Y1 KR950009864Y1 (en) 1995-11-23

Family

ID=19347428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92026282U KR950009864Y1 (en) 1992-12-23 1992-12-23 Chip silo

Country Status (1)

Country Link
KR (1) KR950009864Y1 (en)

Also Published As

Publication number Publication date
KR950009864Y1 (en) 1995-11-23

Similar Documents

Publication Publication Date Title
NO931286D0 (en) FOERINGSROER PACKAGES
DE69333796D1 (en) Semiconductor memory
FI923351A (en) POLYISOCYANATER FOERLAENGDA UREA
DE69326579D1 (en) Packaging structure
ATA229192A (en) SILO UNIT
ITMI920756A0 (en) MIXING SILO
DE69313062D1 (en) Direct chip assembly
DE69322140D1 (en) Semiconductor package
DE69327125T2 (en) Semiconductor memory
KR940003042A (en) Semiconductor memory
FI935553A (en) TOEMNINGSANORDNING FOER SILO
KR940014993U (en) Chip silo
NO931249D0 (en) LEAD CONE-light means
DE59308065D1 (en) packaging
FI930818A (en) SAEKERHETSNAET FOER EN SILO
KR940017874U (en) Ceramic package
KR940011118U (en) Lead-on-chip package
ATA193592A (en) PACKAGING
KR940006479U (en) Multi-chip package
FI940091A0 (en) Covered container
KR940013675U (en) Semiconductor package
KR930024367U (en) Semiconductor package
KR940009430U (en) Weaning organization
KR940013657U (en) Lead-on-chip package
NO933608D0 (en) PACKAGING

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20060911

Year of fee payment: 12

EXPY Expiration of term