KR940008067A - Semiconductor device and manufacturing method thereof - Google Patents
Semiconductor device and manufacturing method thereof Download PDFInfo
- Publication number
- KR940008067A KR940008067A KR1019920017606A KR920017606A KR940008067A KR 940008067 A KR940008067 A KR 940008067A KR 1019920017606 A KR1019920017606 A KR 1019920017606A KR 920017606 A KR920017606 A KR 920017606A KR 940008067 A KR940008067 A KR 940008067A
- Authority
- KR
- South Korea
- Prior art keywords
- wiring
- insulating layer
- contact
- semiconductor device
- exposed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
본 발명은 다층 배선이 형성되는 반도체 장치를 있어서 배선층간의 접촉 면적을 넓혀서 접촉 저항을 감소시킨 반도체 장치 및 그 제조방법에 관한 것으로서, 표면상에 제1배선이 패턴되어 형성된 제1절연층과, 상기 제1절연층상에 상기 제1배선의 한정된 지역내에서 상부표면과 측면이 노출되도록 제거되어 형성된 제2절연층과, 상기 노출된 제1배선의 상부표면과 측면과 접촉하면서 상기 제2절연층상을 지나가는 제2배선을 포함하여 이루어진 것을 특징으로 한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a multi-layer wiring formed therein, wherein the contact area between wiring layers is reduced to reduce contact resistance, and a method of manufacturing the same. A second insulating layer formed on the first insulating layer so that the upper surface and side surfaces thereof are exposed in a limited area of the first wiring, and the second insulating layer image being in contact with the upper surface and side surfaces of the exposed first wiring line. It is characterized by including a second wiring passing.
본 발명에 의하면, 배선층간의 접촉을 위한 공정 시 정렬곤란에 구애받음 없이 배선층간의 접촉 면적이 증가되어 접촉 저항이 감소되고 접촉의 신뢰도가 향상된다.According to the present invention, the contact area between the wiring layers is increased regardless of the misalignment during the process for the contact between the wiring layers to reduce the contact resistance and improve the reliability of the contact.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도의 (가)-(다)는 본 발명의 일 실시예에 의한 배선층간의 접촉부를 나타낸 평면도 및 단면도.(A)-(c) of FIG. 2 is a plan view and a sectional view showing a contact portion between wiring layers according to an embodiment of the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920017606A KR100207443B1 (en) | 1992-09-26 | 1992-09-26 | Semiconductor device and method for manufacture of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019920017606A KR100207443B1 (en) | 1992-09-26 | 1992-09-26 | Semiconductor device and method for manufacture of the same |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940008067A true KR940008067A (en) | 1994-04-28 |
KR100207443B1 KR100207443B1 (en) | 1999-07-15 |
Family
ID=19340172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920017606A KR100207443B1 (en) | 1992-09-26 | 1992-09-26 | Semiconductor device and method for manufacture of the same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100207443B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100892243B1 (en) * | 2005-07-08 | 2009-04-09 | 주식회사 토이론 | Foam pad for pipe |
-
1992
- 1992-09-26 KR KR1019920017606A patent/KR100207443B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100892243B1 (en) * | 2005-07-08 | 2009-04-09 | 주식회사 토이론 | Foam pad for pipe |
Also Published As
Publication number | Publication date |
---|---|
KR100207443B1 (en) | 1999-07-15 |
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