KR940003288Y1 - Plastic packaged semiconductor device - Google Patents
Plastic packaged semiconductor device Download PDFInfo
- Publication number
- KR940003288Y1 KR940003288Y1 KR94002040U KR19940002040U KR940003288Y1 KR 940003288 Y1 KR940003288 Y1 KR 940003288Y1 KR 94002040 U KR94002040 U KR 94002040U KR 19940002040 U KR19940002040 U KR 19940002040U KR 940003288 Y1 KR940003288 Y1 KR 940003288Y1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- packaged semiconductor
- plastic packaged
- plastic
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR94002040U KR940003288Y1 (en) | 1989-09-12 | 1994-02-03 | Plastic packaged semiconductor device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1236408A JP2637247B2 (en) | 1989-09-12 | 1989-09-12 | Resin-sealed semiconductor device |
| KR1019900014334A KR910007094A (en) | 1989-09-12 | 1990-09-12 | Resin Sealed Semiconductor Device |
| KR94002040U KR940003288Y1 (en) | 1989-09-12 | 1994-02-03 | Plastic packaged semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR940003288Y1 true KR940003288Y1 (en) | 1994-05-19 |
Family
ID=27332367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR94002040U KR940003288Y1 (en) | 1989-09-12 | 1994-02-03 | Plastic packaged semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940003288Y1 (en) |
-
1994
- 1994-02-03 KR KR94002040U patent/KR940003288Y1/en not_active IP Right Cessation
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20030430 Year of fee payment: 10 |
|
| LAPS | Lapse due to unpaid annual fee |