KR940003135Y1 - Sleeve for semiconductor packing - Google Patents
Sleeve for semiconductor packing Download PDFInfo
- Publication number
- KR940003135Y1 KR940003135Y1 KR2019910009390U KR910009390U KR940003135Y1 KR 940003135 Y1 KR940003135 Y1 KR 940003135Y1 KR 2019910009390 U KR2019910009390 U KR 2019910009390U KR 910009390 U KR910009390 U KR 910009390U KR 940003135 Y1 KR940003135 Y1 KR 940003135Y1
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- South Korea
- Prior art keywords
- sleeve
- semiconductor
- bent
- present
- piece
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 일부 사시도.1 is a partial perspective view of the present invention.
제2도는 본 고안의 슬리이브 양끝단을 폐쇄시키는 상태를 나타낸 측면도.Figure 2 is a side view showing a state of closing both ends of the sleeve of the present invention.
제3도는 종래 슬리이브에 반도체를 팩킹시키기 위해 슬리이브 끝단을 폐쇄시키는 상태를 나타낸 종단면도 및 분해 사시도.Figure 3 is a longitudinal sectional view and an exploded perspective view showing a state in which the end of the sleeve is closed in order to pack the semiconductor in the conventional sleeve.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 슬리이브 3 : 절곡편1: sleeve 3: bending piece
4 : 절결홈4: Notch groove
본 고안은 반도체 제조공정에서 제조완료된 반도체를 팩킹하는 슬리이브의 구조에 관한 것으로서, 특히 슬리이브의 양끝단에 형성된 개방부를 별도의 부품을 사용하지 않고도 폐쇄시킬수 있도록 한 것이다.The present invention relates to a structure of a sleeve for packing a semiconductor manufactured in the semiconductor manufacturing process, and in particular, to be able to close the openings formed at both ends of the sleeve without using a separate component.
일반적으로 반도체 제조 공정에서 제조완료된 반도체는 튜브 형상의 플라스틱 슬리이브에 동일 방향으로 차폐로 팩킹하도록 되어 있는데, 이때 팩킹된 반도체가 슬리이브내에서 빠져나오는 것을 방지하기 위해 양끝단 개방부를 폐쇄시키는 수단이 필요하게 된다.In general, semiconductors manufactured in the semiconductor manufacturing process are packed in a tube-shaped plastic sleeve with shielding in the same direction, whereby means for closing the openings at both ends to prevent the packed semiconductor from escaping from the sleeve is provided. It is necessary.
종래에는 제3a-c도에 도시한 바와같이 슬리이브(11)내에 반도체(15)를 팩킹하기 전에 일측단의 개방부(12)를 별도의 고무플러그(13)나 핀(14) 또는 고무링(16)을 이용하여 폐쇄시킨후 슬리이브(11)의 내부에 반도체(15)를 팩킹하고, 팩킹완료후에는 다른 일단을 전술한 바와같은 별도의 부품을 이용하여 폐쇄시키도록 되어 있다.Conventionally, as shown in FIGS. 3A-C, before opening the semiconductor 15 in the sleeve 11, the opening 12 at one end is separated by a rubber plug 13, a fin 14, or a rubber ring. After closing using (16), the semiconductor 15 is packed inside the sleeve 11, and after the packing is completed, the other end is closed by using a separate component as described above.
그러나 이러한 종래의 슬리이브 양끝단을 제3a-c도와 같이 고무플러그(13)나 핀(14) 그리고 무링(16)을 이용하여 폐쇄시키고자 할 경우에는 작업자가 일일이 하나씩 슬라이브(11)의 개방부(12)를 수작업으로 폐쇄시켜야 되었으므로 작업능률이 저하되었음은 물론 운반중에 부주의로 고무플러그(13)나 핀(14) 그리고 고무링(16)이 슬리이브(11)에서 빠질경우에는 슬리이브(11)내에 삽입되었던 반도체(15)가 쏟아져 파손되는 등의 결점이 있었다.However, in order to close both ends of the conventional sleeve by using the rubber plug 13, the pin 14 and the mooring ring 16 as shown in 3a-c, the worker opens the slide 11 one by one. Since the part 12 had to be closed by hand, the work efficiency was deteriorated, and the rubber plug 13, the pin 14 and the rubber ring 16 were inadvertently removed from the sleeve 11 during transportation. There was a defect such that the semiconductor 15 inserted in 11) spilled and damaged.
또한 (b)와 같이 핀(14)을 이용하여 슬리이브(11)의 양끝단을 폐쇄시키기 위해서는 슬리이브(11)에 별도의 삽입공(17)을 형성하여야 되었으므로 생산성이 저하되는 결점도 있었다.In addition, as shown in (b), in order to close both ends of the sleeve 11 by using the pin 14, an additional insertion hole 17 must be formed in the sleeve 11, and thus there is a disadvantage in that the productivity decreases.
본 고안은 종래의 이와같은 결점을 해결하기 위해 안출한 것으로서, 슬리이브의 내부에 반도체를 팩킹하도록된 것에 있어서, 슬리이브 양끝단의 내측 상부로 절곡편이 형성되도록 절결홈을 형성하여 절곡편을 눌러줌에 따라 절곡편이 하방으로 절곡될수 있도록 된 반도체 팩킹용 슬리이브의 구조가 제공된다.The present invention has been devised to solve such a drawback of the prior art, in which the semiconductor is packed inside the sleeve, forming a bent groove so as to form a bent piece on the inner top of both ends of the sleeve and pressing the bent piece. There is provided a structure of a sleeve for semiconductor packing in which the bending piece can be bent downward as the zoom is provided.
이하, 본 고안을 일시시예로 도시한 첨부된 도면 제1도 내지 제2도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIGS.
첨부도면 제1도는 본 고안의 일부 사시도이고, 제2도는 슬리이브의 양끝단을 폐쇄시키는 상태를 나타낸 측면도로서, 본 고안은 슬리이브(1)의 양끝단에 형성된 개방부(2) 내측 상부로 한쌍의 절곡편(3)이 형성되도록 절결홈(4)이 형성되어 있어 절곡편(3)을 눌러 하향 절곡시킴에 따라 내부에 삽입된 반도체(5)가 절곡편(3)에 걸려 슬리이브(1)에서 빠지는 것을 방지하도록 되어 있다.1 is a partial perspective view of the present invention, and FIG. 2 is a side view showing a state in which both ends of the sleeve are closed, and the present invention is directed toward the inside of the opening 2 formed at both ends of the sleeve 1. A notch groove 4 is formed so that a pair of bent pieces 3 are formed. As the bent pieces 3 are pressed downward to be bent, the semiconductor 5 inserted therein is caught by the bent pieces 3 and the sleeve ( It is to prevent falling out in 1).
이와같이 구성된 본 고안은 먼저 제2a도와 같이 슬리이브(1)내에 반도체(5)를 삽입하기 전에 슬리이브(1)의 양끝단의 내측 상부에 형성된 절곡편(3)을 45도 방향, 즉 화살표 방향으로 눌러주면 절곡편(3)이 (b)와 같이 90도 하향 절곡된다.The present invention constructed as described above has a 45-degree direction, that is, an arrow direction, for the bent piece 3 formed on the inner upper ends of both ends of the sleeve 1 before the semiconductor 5 is inserted into the sleeve 1 as shown in FIG. When pressed, the bending piece 3 is bent downward by 90 degrees as shown in (b).
절곡편(3)을 하향 절곡시킨후 슬리이브(1)의 다른 일측 개방부를 통해 반도체(5)를 차례로 삽입시키면 반도체(5)의 일측면이 절곡편(3)에 의해 걸려 이송이 제어되므로 슬리이브(1)내에 반도체(5)를 차폐로 삽입시킬수 있게 된다.When the bent piece 3 is bent downward and the semiconductor 5 is sequentially inserted through the other open portion of the sleeve 1, one side of the semiconductor 5 is caught by the bent piece 3 so that the transfer is controlled. The semiconductor 5 can be inserted into the eve 1 by shielding.
슬리이브(1)내에 반도체(5)의 삽입을 완료한 후 다른 일측의 개방부에 형성된 절곡편을 전술한 바와같은 동작으로 눌러주면 슬리이브(1)내에 삽입되어진 반도체(5)가 외부로 쏟아지지 않게 된다.After the insertion of the semiconductor 5 into the sleeve 1 is completed, pressing the bent piece formed on the opening of the other side in the same manner as described above, the semiconductor 5 inserted into the sleeve 1 is poured out. You won't lose.
또한 삽입된 반도체(5)를 슬리이브(1)내에서 꺼내고자 할 경우에는 하향절곡된 절곡편(3)을 상방으로 들어올리면 되는데, 이때에는 슬리이브(1)가 플라스틱재로 되어있어 자체 탄성력에 의해 최초의 상태로 환원되므로 개방부를 통해 반도체(5)를 꺼낼 수 있게 되는 것이다.In addition, when the inserted semiconductor 5 is to be taken out of the sleeve 1, the bent piece 3 bent upwards may be lifted upward. By reducing to the initial state by the semiconductor 5 can be taken out through the opening.
이상에서와 같이 본 고안은 슬리이브(1)의 양끝단 상부로 절곡편(3)이 형성되도록 절결홈(4)을 형성하여 절곡편(3)을 하향 절곡시킴으로서 별도의 부품을 사용하지 않고도 슬리이브(1)내에서 반도체(5)가 빠지는 것을 방지하도록 되어 있으므로 작업능률을 향상시킬수 있게됨은 물론 슬리이브(1)내에 삽입되었던 반도체(5)가 쏟아지는 것을 미연에 방지할수 있게되는 효과가 있다.As described above, the present invention forms the notch grooves 4 so that the bent pieces 3 are formed on both ends of the sleeve 1 so that the bent pieces 3 are downwardly bent without using a separate part. Since the semiconductor 5 is prevented from falling out in the eve 1, the work efficiency can be improved, and the semiconductor 5 inserted into the sleeve 1 can be prevented from spilling.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910009390U KR940003135Y1 (en) | 1991-06-24 | 1991-06-24 | Sleeve for semiconductor packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910009390U KR940003135Y1 (en) | 1991-06-24 | 1991-06-24 | Sleeve for semiconductor packing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR930001530U KR930001530U (en) | 1993-01-21 |
| KR940003135Y1 true KR940003135Y1 (en) | 1994-05-12 |
Family
ID=19315506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910009390U KR940003135Y1 (en) | 1991-06-24 | 1991-06-24 | Sleeve for semiconductor packing |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR940003135Y1 (en) |
-
1991
- 1991-06-24 KR KR2019910009390U patent/KR940003135Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR930001530U (en) | 1993-01-21 |
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