KR940002963A - Impact Relief Device for Drain Valve for Wafer Cleaning Tank - Google Patents

Impact Relief Device for Drain Valve for Wafer Cleaning Tank Download PDF

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Publication number
KR940002963A
KR940002963A KR1019920012540A KR920012540A KR940002963A KR 940002963 A KR940002963 A KR 940002963A KR 1019920012540 A KR1019920012540 A KR 1019920012540A KR 920012540 A KR920012540 A KR 920012540A KR 940002963 A KR940002963 A KR 940002963A
Authority
KR
South Korea
Prior art keywords
valve
cylinder
impact
cleaning tank
wafer
Prior art date
Application number
KR1019920012540A
Other languages
Korean (ko)
Other versions
KR950009287B1 (en
Inventor
최원욱
Original Assignee
문정환
금성일렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론주식회사 filed Critical 문정환
Priority to KR1019920012540A priority Critical patent/KR950009287B1/en
Publication of KR940002963A publication Critical patent/KR940002963A/en
Application granted granted Critical
Publication of KR950009287B1 publication Critical patent/KR950009287B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Details Of Valves (AREA)
  • Check Valves (AREA)

Abstract

본 발명은 웨이퍼세척조에서 웨이퍼를 세척한 후 세척조를 배수시킬때 밸브구동용 실린더의 작동에 의한 충격이 세척조에 전달되는 것을 최대한으로 완화시킬 수 있게한 배수밸브의 충격완화 장치에 관한 것으로, 실린더에 교축부와 체크밸브를 부설하여 이들 교축부와 체크밸브기 에어쿳션의 역할을 수행하게 함으로써 충격으로 인한 세척조의 손상이나 파손을 방지하도록 한것이다.상기 목적에 따라 본 발명은 배수밸브의 밸브판(6)을 실린더의 피스턴로드(9)에 고정하여 실린더의 구동에 따라 밸브가 개폐되도록 한것이 있어서, 실린더 배럴(8)의 상ㆍ하부공간에 단면적이 작은 에어통로(14)(15)와 이들 에어통로를 연통시키는 오리피스(16) 및 판밸브(17)로 이루어진 교축부를 설치하고 그 바깥측에 체크밸브(18)를 각각 설치하여 에어가 교축부와 체크밸브를 통해 배출되면서 압력이 낮아짐에 따라 시린더로드에 가해지는 충격을 감소시킬 수 있게한 웨이퍼 세척용 배수 밸브의 충격 완화장치이다.The present invention relates to an impact relief device of a drain valve, which is capable of maximally mitigating the impact of the operation of the valve driving cylinder to the cleaning tank when the wafer is drained after washing the wafer in the wafer cleaning tank. By installing the throttling unit and the check valve to perform the role of these throttling unit and the check valve air cushion to prevent damage or damage to the cleaning tank due to the impact. 6) is fixed to the piston rod 9 of the cylinder to open and close the valve according to the driving of the cylinder, so that the air passages 14 and 15 having a small cross-sectional area in the upper and lower spaces of the cylinder barrel 8 and these air An orifice (16) and a plate valve (17) which communicate with the passage are provided with throttles, and check valves (18) are provided on the outer side thereof so that air is checked with the throttles. As the probe is withdrawn via a shock-absorbing device of a drain valve for Cylinder cleaning a wafer makes it possible to further reduce the impact applied to the load according to the pressure it is lower.

Description

웨이퍼 세척조용 배수밸브의 충격완화장치Impact Relief Device for Drain Valve for Wafer Cleaning Tank

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래 웨이퍼 세척조용 급수 밸브의 종단면도.1 is a longitudinal sectional view of a water supply valve for a conventional wafer cleaning tank.

제2도는 종래 웨이퍼 세척조용 급수 밸브에 적용되는 실린더의 종단면도.2 is a longitudinal sectional view of a cylinder applied to a water supply valve for a conventional wafer cleaning tank.

제3도는 본 발명의 웨이퍼 세척조용 급수 밸브에 적용되는 실린더의 종단면도.3 is a longitudinal sectional view of a cylinder applied to the water supply valve for a wafer cleaning tank of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 세척조 6 : 밸브판1: washing tank 6: valve plate

8 : 실린더 바렐 9 : 피스턴 로드8: cylinder barrel 9: piston rod

14, 15 : 에어통로 16 : 오리피스14, 15: Air passage 16: Orifice

17 : 판밸브 18 : 체크밸브17: valve valve 18: check valve

Claims (1)

배수밸브의 밸브판(6)을 실린더의 피스턴로드(9)에 고정하여 실린더의 구동에 따라 밸브가 개폐되도록 한 것이 있어서, 실린더 배럴(8)의 상·하공간에 단면적이 작은 에어통로(14), (15)와 이들 에어통로를 연통시키는 오리피스(16) 및 판밸브(17)로 이루어진 교축부를 설치하고 그 바깥측에 체크밸브(18)를 각각 설치하여 에어가 교축부와 체크밸브를 통해 배출되면서 압력이 낮아짐에 따라 실린더로드에 가해지는 충격을 감소시킬 수 있게 한 웨이퍼 세척용 배수밸스의 충격완화장치.Since the valve plate 6 of the drain valve is fixed to the piston rod 9 of the cylinder so that the valve can be opened and closed in accordance with the operation of the cylinder, the air passage 14 having a small cross-sectional area in the upper and lower spaces of the cylinder barrel 8. ), (15) and the orifice (16) and the plate valve (17) for communicating these air passages are provided, and the check valve (18) is provided on the outer side, respectively, so that the air Impact relief device for drainage balance for wafer cleaning to reduce the impact on the cylinder rod as the pressure is lowered through the discharge. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920012540A 1992-07-14 1992-07-14 Buffering apparatus of drain valve for wafer cleaning bath KR950009287B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920012540A KR950009287B1 (en) 1992-07-14 1992-07-14 Buffering apparatus of drain valve for wafer cleaning bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920012540A KR950009287B1 (en) 1992-07-14 1992-07-14 Buffering apparatus of drain valve for wafer cleaning bath

Publications (2)

Publication Number Publication Date
KR940002963A true KR940002963A (en) 1994-02-19
KR950009287B1 KR950009287B1 (en) 1995-08-18

Family

ID=19336324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920012540A KR950009287B1 (en) 1992-07-14 1992-07-14 Buffering apparatus of drain valve for wafer cleaning bath

Country Status (1)

Country Link
KR (1) KR950009287B1 (en)

Also Published As

Publication number Publication date
KR950009287B1 (en) 1995-08-18

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