KR930018789U - Integrated circuit transfer device - Google Patents

Integrated circuit transfer device

Info

Publication number
KR930018789U
KR930018789U KR2019920001019U KR920001019U KR930018789U KR 930018789 U KR930018789 U KR 930018789U KR 2019920001019 U KR2019920001019 U KR 2019920001019U KR 920001019 U KR920001019 U KR 920001019U KR 930018789 U KR930018789 U KR 930018789U
Authority
KR
South Korea
Prior art keywords
integrated circuit
transfer device
circuit transfer
integrated
transfer
Prior art date
Application number
KR2019920001019U
Other languages
Korean (ko)
Other versions
KR960006411Y1 (en
Inventor
오석주
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR92001019U priority Critical patent/KR960006411Y1/en
Publication of KR930018789U publication Critical patent/KR930018789U/en
Application granted granted Critical
Publication of KR960006411Y1 publication Critical patent/KR960006411Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR92001019U 1992-01-24 1992-01-24 Integrated circuit transfer device KR960006411Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR92001019U KR960006411Y1 (en) 1992-01-24 1992-01-24 Integrated circuit transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR92001019U KR960006411Y1 (en) 1992-01-24 1992-01-24 Integrated circuit transfer device

Publications (2)

Publication Number Publication Date
KR930018789U true KR930018789U (en) 1993-08-21
KR960006411Y1 KR960006411Y1 (en) 1996-07-24

Family

ID=19328265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR92001019U KR960006411Y1 (en) 1992-01-24 1992-01-24 Integrated circuit transfer device

Country Status (1)

Country Link
KR (1) KR960006411Y1 (en)

Also Published As

Publication number Publication date
KR960006411Y1 (en) 1996-07-24

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040621

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee