KR930018782A

KR930018782A - Connection method of socket-mounted module device and module device

Info

Publication number: KR930018782A
Application number: KR1019920002368A
Authority: KR
Inventors: 박기; 이국상
Original assignee: 김광호; 삼성전자 주식회사
Filing date: 1992-02-18
Publication date: 1993-09-22

Abstract

이 발명은 메모리 용량을 확장하고 조립시 발생하는 스트레스를 줄이기 위한 소켓 장착형 모듈장치 및 모듈장치의 연결방법에 관한 것이다. 한개의 칩에서 멀티 비트를 구성할 수 있는 소켓 장착형 모듈장치는 한쌍의 접촉 수단과, 돌출부 및 소켓 몸체부로 구성된다. 또한, 소켓 장착형 모듈장치를 이용하여 메모리 모듈을 전기적으로 연결하는 방법을 제공하고 메모리 용량을 확장시키고자 할때 단지 모듈장치의 수만을 증가시켜 메모리 용량을 확장시킬 수 있는 방법을 제공한다.The present invention relates to a socket-mounted module device and a method of connecting the module device to expand the memory capacity and reduce the stress caused during assembly. A socket-mounted module device capable of constituting multiple bits in one chip is composed of a pair of contact means, a protrusion and a socket body. In addition, the present invention provides a method of electrically connecting a memory module using a socket-mounted module device, and provides a method of expanding the memory capacity by increasing only the number of module devices when the memory capacity is to be expanded.

Description

Connection method of socket-mounted module device and module device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 이 발명의 모듈장치에 기판을 삽입한 상태를 개략적으로 나타낸 도면.1 is a view schematically showing a state in which a substrate is inserted into the module device of the present invention.

제2A도 및 제2B도는 이 발명의 소켓 장착형 모듈장치의 단면도.2A and 2B are cross-sectional views of the socket-mounted module device of the present invention.

제3도는 종래의 메모리 모듈의 기계적인 배치도이다.3 is a mechanical layout of a conventional memory module.

Claims

A socket-mounted module device for electrically connecting a memory module in electrical contact along a module edge on a printed circuit board, comprising: a pair of contact means for accommodating both ends of the memory module and a lead line on the printed circuit board; A socket-mountable module device comprising protruding protrusions to be spaced apart from a printed circuit board, and a socket body part configured to be inserted into the printed circuit board and accommodating a substrate on which a memory module is mounted.

The socket-mounted module device according to claim 1, wherein the contact means is made of gold-plated copper.

2. The socket mounted module device according to claim 1, wherein said socket body portion is made of a plastic material such as plastic.

A method for electrically connecting a memory module in electrical contact along a module edge on a printed circuit board using a socket mounted module device, the method comprising: a) a socket mounted type having a pair of contact means to receive both ends of the memory module; Providing a module device on a printed circuit board, b) providing a substrate on which a memory module is mounted to the socket-mounted module device, and c) bending a lead corresponding to the substrate.

5. The method of claim 4, further comprising increasing the number of module devices without replacing the entire memory module when increasing the memory capacity in providing the socket-mounted module device on a printed circuit board. Way.

※ Note: This is to be disclosed by the original application.