KR930018699A - Semiconductor devices - Google Patents

Semiconductor devices Download PDF

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Publication number
KR930018699A
KR930018699A KR1019920002973A KR920002973A KR930018699A KR 930018699 A KR930018699 A KR 930018699A KR 1019920002973 A KR1019920002973 A KR 1019920002973A KR 920002973 A KR920002973 A KR 920002973A KR 930018699 A KR930018699 A KR 930018699A
Authority
KR
South Korea
Prior art keywords
semiconductor device
runner
semiconductor chip
epoxy
semiconductor devices
Prior art date
Application number
KR1019920002973A
Other languages
Korean (ko)
Other versions
KR950003905B1 (en
Inventor
박종영
최종곤
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019920002973A priority Critical patent/KR950003905B1/en
Publication of KR930018699A publication Critical patent/KR930018699A/en
Application granted granted Critical
Publication of KR950003905B1 publication Critical patent/KR950003905B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

이 발명은 중앙의 일점을 중심으로 반사상 형태의 러너를 이용하여 용이하게 반도체 칩을 접착할 수 있는 반도체 장치를 게재한다.This invention discloses the semiconductor device which can adhere | attach a semiconductor chip easily using the runner of a reflection shape centering on one point in the center.

또한, 이와같이 구성된 반도체 장치는 반도체 칩의 가장자리 부분까지 에폭시를 고르게 퍼지게 할 수 있고, 과다넘침을 방지할 수 있으며 에폭시 커버리지를 향상시킬 수 있다.In addition, the semiconductor device configured as described above can evenly spread the epoxy to the edge portion of the semiconductor chip, prevent excessive overflow and improve epoxy coverage.

Description

반도체 장치Semiconductor devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도는 이 발명에 따른 반도체 장치의 실시예를 나타내는 다이패드의 평면도이다.4 is a plan view of a die pad showing an embodiment of a semiconductor device according to the present invention.

제5도의 (a)와 (b)는 이 발명에 따른 반도체 장치의 일실시예를 나타내는 사시도 및 평면도이다.5A and 5B are a perspective view and a plan view showing one embodiment of a semiconductor device according to the present invention.

Claims (4)

다이패드에 반도체 칩을 접착시키기 위한 반도체 장치에 있어서, 상기 반도체 칩을 용이하게 접착하기 위하여 중앙의 일점을 중심으로 방사상 형태의 러너를 구비한 반도체 장치.A semiconductor device for adhering a semiconductor chip to a die pad, the semiconductor device including a runner having a radial shape around a central point for easily bonding the semiconductor chip. 제1항에 있어서, 러너는 외부의 모양이 아치형으로 된 반도체 장치.The semiconductor device according to claim 1, wherein the runner has an outer shape of an arch. 제1항에 있어서, 러너는 접착제의 퍼짐성을 좋게할 수 있도록된 반도체 장치.The semiconductor device according to claim 1, wherein the runner is capable of improving the spreadability of the adhesive. 제1항에 있어서, 러너는 에폭시의 과다넘침을 방지할 수 있도록된 반도체 장치.The semiconductor device according to claim 1, wherein the runner is capable of preventing the overflow of epoxy. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920002973A 1992-02-26 1992-02-26 Semiconductor device KR950003905B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920002973A KR950003905B1 (en) 1992-02-26 1992-02-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920002973A KR950003905B1 (en) 1992-02-26 1992-02-26 Semiconductor device

Publications (2)

Publication Number Publication Date
KR930018699A true KR930018699A (en) 1993-09-22
KR950003905B1 KR950003905B1 (en) 1995-04-20

Family

ID=19329513

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920002973A KR950003905B1 (en) 1992-02-26 1992-02-26 Semiconductor device

Country Status (1)

Country Link
KR (1) KR950003905B1 (en)

Also Published As

Publication number Publication date
KR950003905B1 (en) 1995-04-20

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