KR930016222U - Mold die without gate - Google Patents

Mold die without gate

Info

Publication number
KR930016222U
KR930016222U KR2019910023207U KR910023207U KR930016222U KR 930016222 U KR930016222 U KR 930016222U KR 2019910023207 U KR2019910023207 U KR 2019910023207U KR 910023207 U KR910023207 U KR 910023207U KR 930016222 U KR930016222 U KR 930016222U
Authority
KR
South Korea
Prior art keywords
gate
mold die
mold
die
Prior art date
Application number
KR2019910023207U
Other languages
Korean (ko)
Other versions
KR0121648Y1 (en
Inventor
노길섭
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019910023207U priority Critical patent/KR0121648Y1/en
Publication of KR930016222U publication Critical patent/KR930016222U/en
Application granted granted Critical
Publication of KR0121648Y1 publication Critical patent/KR0121648Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR2019910023207U 1991-12-21 1991-12-21 Mold die without a gate KR0121648Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910023207U KR0121648Y1 (en) 1991-12-21 1991-12-21 Mold die without a gate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910023207U KR0121648Y1 (en) 1991-12-21 1991-12-21 Mold die without a gate

Publications (2)

Publication Number Publication Date
KR930016222U true KR930016222U (en) 1993-07-28
KR0121648Y1 KR0121648Y1 (en) 1998-08-17

Family

ID=19324999

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910023207U KR0121648Y1 (en) 1991-12-21 1991-12-21 Mold die without a gate

Country Status (1)

Country Link
KR (1) KR0121648Y1 (en)

Also Published As

Publication number Publication date
KR0121648Y1 (en) 1998-08-17

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
LAPS Lapse due to unpaid annual fee