KR930016193U - I.c 패케이지 성형용 금형 - Google Patents
I.c 패케이지 성형용 금형Info
- Publication number
- KR930016193U KR930016193U KR2019910023488U KR910023488U KR930016193U KR 930016193 U KR930016193 U KR 930016193U KR 2019910023488 U KR2019910023488 U KR 2019910023488U KR 910023488 U KR910023488 U KR 910023488U KR 930016193 U KR930016193 U KR 930016193U
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- package molding
- package
- molding
- Prior art date
Links
- 238000000465 moulding Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910023488U KR0121644Y1 (ko) | 1991-12-23 | 1991-12-23 | I.c 패케이지 성형용 금형 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019910023488U KR0121644Y1 (ko) | 1991-12-23 | 1991-12-23 | I.c 패케이지 성형용 금형 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR930016193U true KR930016193U (ko) | 1993-07-28 |
KR0121644Y1 KR0121644Y1 (ko) | 1998-08-17 |
Family
ID=19325225
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019910023488U KR0121644Y1 (ko) | 1991-12-23 | 1991-12-23 | I.c 패케이지 성형용 금형 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0121644Y1 (ko) |
-
1991
- 1991-12-23 KR KR2019910023488U patent/KR0121644Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0121644Y1 (ko) | 1998-08-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040326 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |