KR930012965A - Epoxy Resin Composition (1) for Semiconductor Device Encapsulation - Google Patents

Epoxy Resin Composition (1) for Semiconductor Device Encapsulation Download PDF

Info

Publication number
KR930012965A
KR930012965A KR1019910025638A KR910025638A KR930012965A KR 930012965 A KR930012965 A KR 930012965A KR 1019910025638 A KR1019910025638 A KR 1019910025638A KR 910025638 A KR910025638 A KR 910025638A KR 930012965 A KR930012965 A KR 930012965A
Authority
KR
South Korea
Prior art keywords
resin composition
epoxy resin
semiconductor device
modifier
device encapsulation
Prior art date
Application number
KR1019910025638A
Other languages
Korean (ko)
Other versions
KR950011904B1 (en
Inventor
조광수
박윤곡
유금원
Original Assignee
채오병
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 채오병, 제일모직 주식회사 filed Critical 채오병
Priority to KR1019910025638A priority Critical patent/KR950011904B1/en
Publication of KR930012965A publication Critical patent/KR930012965A/en
Application granted granted Critical
Publication of KR950011904B1 publication Critical patent/KR950011904B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

본 발명은 에폭시 수지 조성물에 관한 것이다.The present invention relates to an epoxy resin composition.

본 발명은 균열의 전파가 방지되고, 내습성이 향상된 반도체 수지 봉지용 에폭시 수지 조성물을 제공하는 것을 목적으로 한다.An object of this invention is to provide the epoxy resin composition for semiconductor resin sealing which the propagation of a crack is prevented and moisture resistance improved.

본 발명은 유기섬유를 변성제로 사용하는 것을 특징으로 하며, 그 적절한 사용량은 0.5-1.0중량%이다.The present invention is characterized by the use of organic fibers as a modifier, the appropriate amount of use is 0.5-1.0% by weight.

Description

반도체 소자 봉지용 에폭시 수지 조성물(1)Epoxy Resin Composition (1) for Semiconductor Device Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (5)

유기섬유를 변성제로 사용하는 것을 특징으로 하는 에폭시 수지 조성물.An epoxy resin composition, wherein the organic fiber is used as a modifier. 제1항에 있어서, 변성제로 유기섬유를 실리콘 오일과 함께 사용하는 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein organic fibers are used together with silicone oil as a modifier. 제1하에 있어서, 변성제로 유기섬유를 CTBN고무입자와 함께 사용하는 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein an organic fiber is used together with CTBN rubber particles as a modifier. 제1하에 있어서, 변성제로 유기섬유를 실리콘 오일 및 CTBN고무입자와 함께 사용하는 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein an organic fiber is used together with silicone oil and CTBN rubber particles as a modifier. 제1항에 있어서, 유기섬유를 0.5-10wt% 포함하는 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, comprising 0.5-10 wt% of organic fibers. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910025638A 1991-12-31 1991-12-31 Epoxy resin composition for encapsulating semiconductor parts KR950011904B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910025638A KR950011904B1 (en) 1991-12-31 1991-12-31 Epoxy resin composition for encapsulating semiconductor parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910025638A KR950011904B1 (en) 1991-12-31 1991-12-31 Epoxy resin composition for encapsulating semiconductor parts

Publications (2)

Publication Number Publication Date
KR930012965A true KR930012965A (en) 1993-07-21
KR950011904B1 KR950011904B1 (en) 1995-10-12

Family

ID=19327130

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910025638A KR950011904B1 (en) 1991-12-31 1991-12-31 Epoxy resin composition for encapsulating semiconductor parts

Country Status (1)

Country Link
KR (1) KR950011904B1 (en)

Also Published As

Publication number Publication date
KR950011904B1 (en) 1995-10-12

Similar Documents

Publication Publication Date Title
KR910006416A (en) Thermosetting resin composition
FR2557121B1 (en) HOT VULCANIZABLE ORGANOPOLYSILOXANIC ELASTOMERIC COMPOSITIONS WITH IMPROVED PHYSICAL CHARACTERISTICS
KR860001167A (en) Solvent-free polyimide-modified epoxy compositions
KR910003024A (en) Curable Silicone Rubber Composition and Its Cured Product
KR920018142A (en) Epoxy Resin Compositions and Semiconductor Devices
KR890016659A (en) Epoxy Resin Composition for Sealing and Closing Semiconductors
ES2074453T3 (en) CURABLE POLYMER COMPOSITION.
KR910006415A (en) Thermosetting resin composition
KR900014507A (en) Low Stress Epoxy Encapsulant Compositions And Additive Mixtures For The Same
KR930012965A (en) Epoxy Resin Composition (1) for Semiconductor Device Encapsulation
KR910016854A (en) Epoxy Resin Compositions for Semiconductor Encapsulation
KR910002428A (en) Trorch composition
KR930006070A (en) Novel Imide Epoxy Resin and Its Manufacturing Method
KR900012671A (en) Iron (Ⅱ) Composition
KR920018161A (en) Permeable Silicone Water Repellent Composition
KR900018257A (en) Epoxy Resin Compositions for Semiconductor Device Sealing
KR920002706A (en) Anaerobic Curable Composition
KR900018256A (en) Epoxy Resin Compositions for Semiconductor Device Sealing
KR900003307A (en) Polymer Elastomer Composition
KR920004591A (en) Leadframe Materials for Bare Bonding
KR880001763A (en) Epoxy Resin Composition for Semiconductor Encapsulation
KR920002699A (en) Epoxy Resin Composition for Sealing Semiconductor Devices
KR960017774A (en) Epoxy Resin Compositions for Semiconductor Device Sealing
KR910012060A (en) Epoxy Resin Composition for Sealing Semiconductor Devices
KR920018524A (en) Photosensitive resin composition

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20081001

Year of fee payment: 14

LAPS Lapse due to unpaid annual fee