KR930012119U - Automatic measuring device for real surface temperature of semiconductor injection mold - Google Patents

Automatic measuring device for real surface temperature of semiconductor injection mold

Info

Publication number
KR930012119U
KR930012119U KR2019910019478U KR910019478U KR930012119U KR 930012119 U KR930012119 U KR 930012119U KR 2019910019478 U KR2019910019478 U KR 2019910019478U KR 910019478 U KR910019478 U KR 910019478U KR 930012119 U KR930012119 U KR 930012119U
Authority
KR
South Korea
Prior art keywords
measuring device
surface temperature
injection mold
automatic measuring
real surface
Prior art date
Application number
KR2019910019478U
Other languages
Korean (ko)
Other versions
KR940007812Y1 (en
Inventor
강대순
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910019478U priority Critical patent/KR940007812Y1/en
Publication of KR930012119U publication Critical patent/KR930012119U/en
Application granted granted Critical
Publication of KR940007812Y1 publication Critical patent/KR940007812Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00Thermometers specially adapted for specific purposes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
KR2019910019478U 1991-11-14 1991-11-14 Temperature measuring apparatus of semiconductor moulding surface KR940007812Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910019478U KR940007812Y1 (en) 1991-11-14 1991-11-14 Temperature measuring apparatus of semiconductor moulding surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910019478U KR940007812Y1 (en) 1991-11-14 1991-11-14 Temperature measuring apparatus of semiconductor moulding surface

Publications (2)

Publication Number Publication Date
KR930012119U true KR930012119U (en) 1993-06-25
KR940007812Y1 KR940007812Y1 (en) 1994-10-24

Family

ID=19322223

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910019478U KR940007812Y1 (en) 1991-11-14 1991-11-14 Temperature measuring apparatus of semiconductor moulding surface

Country Status (1)

Country Link
KR (1) KR940007812Y1 (en)

Also Published As

Publication number Publication date
KR940007812Y1 (en) 1994-10-24

Similar Documents

Publication Publication Date Title
DE69028734T2 (en) Optical semiconductor device
DE69030148D1 (en) Optical semiconductor device
DE69223356T2 (en) Fixing device with temperature measuring device
KR920700817A (en) Casting injection device
DE69030175D1 (en) Optical semiconductor device
KR930012119U (en) Automatic measuring device for real surface temperature of semiconductor injection mold
DE3854989D1 (en) Optical semiconductor device
DE69027281D1 (en) Plastic-coated semiconductor device
KR890008601U (en) Cooling water leak test device of injection mold
KR920003412U (en) D-board for semiconductor device test
KR890018992U (en) Cooling water leakage prevention device of injection mold
DE9218936U1 (en) Temperature measuring device with molded thermistor
KR930006396U (en) Ejector pin device of injection mold
KR920000250A (en) Automatic tofu molding device for tofu manufacturing
KR900009859U (en) Slide core device of injection mold
KR880014871U (en) Thermocouple support device of injection molding machine
KR920006109U (en) Gate automatic cutting device of injection mold
KR900000455U (en) Injection mold slide device
KR900009877U (en) Device for preventing re-insertion of injection molded products
KR920006103U (en) Device for preventing contamination of foreign matter in the injection mold branch pipe
KR890012909U (en) Automatic shut-off device for injection mold gate
ATA231292A (en) HIGH TEMPERATURE MEASURING DEVICE
KR850001392U (en) Automatic injection molding device
KR910012235U (en) Digital height measuring device for semiconductor devices
KR940013662U (en) Heater block device capable of measuring wafer substrate temperature

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050922

Year of fee payment: 12

EXPY Expiration of term