KR930009740U - Circuit board structure of Multi Chip Module - Google Patents

Circuit board structure of Multi Chip Module

Info

Publication number
KR930009740U
KR930009740U KR2019910017137U KR910017137U KR930009740U KR 930009740 U KR930009740 U KR 930009740U KR 2019910017137 U KR2019910017137 U KR 2019910017137U KR 910017137 U KR910017137 U KR 910017137U KR 930009740 U KR930009740 U KR 930009740U
Authority
KR
South Korea
Prior art keywords
circuit board
chip module
board structure
multi chip
module
Prior art date
Application number
KR2019910017137U
Other languages
Korean (ko)
Other versions
KR940006872Y1 (en
Inventor
고준수
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019910017137U priority Critical patent/KR940006872Y1/en
Publication of KR930009740U publication Critical patent/KR930009740U/en
Application granted granted Critical
Publication of KR940006872Y1 publication Critical patent/KR940006872Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
KR2019910017137U 1991-10-15 1991-10-15 Circuit substrate structure of multi chip module KR940006872Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910017137U KR940006872Y1 (en) 1991-10-15 1991-10-15 Circuit substrate structure of multi chip module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910017137U KR940006872Y1 (en) 1991-10-15 1991-10-15 Circuit substrate structure of multi chip module

Publications (2)

Publication Number Publication Date
KR930009740U true KR930009740U (en) 1993-05-26
KR940006872Y1 KR940006872Y1 (en) 1994-10-01

Family

ID=19320594

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910017137U KR940006872Y1 (en) 1991-10-15 1991-10-15 Circuit substrate structure of multi chip module

Country Status (1)

Country Link
KR (1) KR940006872Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100481706B1 (en) * 2002-03-25 2005-04-11 주식회사 넥사이언 Method of fabricating flip chip

Also Published As

Publication number Publication date
KR940006872Y1 (en) 1994-10-01

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Legal Events

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E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
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FPAY Annual fee payment

Payment date: 20040920

Year of fee payment: 11

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