KR930008972A - Wet Processing Equipment - Google Patents

Wet Processing Equipment Download PDF

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Publication number
KR930008972A
KR930008972A KR1019910018316A KR910018316A KR930008972A KR 930008972 A KR930008972 A KR 930008972A KR 1019910018316 A KR1019910018316 A KR 1019910018316A KR 910018316 A KR910018316 A KR 910018316A KR 930008972 A KR930008972 A KR 930008972A
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KR
South Korea
Prior art keywords
processing apparatus
sample
wet processing
liquid
wet
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Application number
KR1019910018316A
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Korean (ko)
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KR940002299B1 (en
Inventor
안태혁
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김광호
삼성전자 주식회사
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Priority to KR1019910018316A priority Critical patent/KR940002299B1/en
Publication of KR930008972A publication Critical patent/KR930008972A/en
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Publication of KR940002299B1 publication Critical patent/KR940002299B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

반도체 소자의 제조공정중 습식에칭, 화학세정, 순수세정에 공용 가능한 습식처리장치을 개시한다. 시료(반도체 웨이퍼)는 그 표면이 아래를 향하도록 진공척에 흡착고정되며, 그 진공척이 구동되는 것에 의하여 회전되어진다. 처리액은 용기에 설치된 압출관으로부터 웨이퍼 표면을 향해 수직상방으로 압출되고 용기로 낙하된다. 상기 웨이퍼의 회전중심과 상기 압출관의 중심은 약간 어긋난다. 이로써 처리액이 웨이퍼의 회전중심부에서 정체되는 현상은 없으며, 전표면이 고르고 높은 표면마찰로 처리액에 의하여 처리된다. 여기서 구동부는 웨이퍼보다 높게 위치하므로 그 구동부에 처리액이 묻을 염려가 없다. 즉, 순수는 물론 부식성강한 화학에칭액, 화학세정제의 처리액 사용이 가능하다.Disclosed are a wet processing apparatus which can be used for wet etching, chemical cleaning, and pure water cleaning in a semiconductor device manufacturing process. The sample (semiconductor wafer) is fixed to the vacuum chuck so that its surface faces downward, and is rotated by driving the vacuum chuck. The processing liquid is extruded vertically upward from the extrusion tube provided in the container toward the wafer surface and falls into the container. The center of rotation of the wafer and the center of the extrusion tube are slightly displaced. Thereby, there is no phenomenon that the treatment liquid is stagnated at the center of rotation of the wafer, and the entire surface is treated by the treatment liquid with an even and high surface friction. In this case, since the driving unit is positioned higher than the wafer, there is no fear of the processing liquid on the driving unit. That is, it is possible to use not only pure water, but also a highly corrosive chemical etching solution and a chemical cleaning solution.

또한 개시된 장치는 처리효과가 높아 표면의 요철이 심한 고집적소자에 유리하며, 일련의 습식처리공정을 순차 처리할 수 있는 형태로 그 용융이 가능하다.In addition, the disclosed apparatus is advantageous for high integration devices having high surface irregularities due to a high treatment effect, and can be melted in a form capable of sequentially processing a series of wet treatment processes.

Description

습식처리장치Wet Processing Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 의한 습식처리장차의 단면도,3 is a cross-sectional view of a wet treatment machine according to the present invention,

제4도는 제3도에 나타난 처리장치를 이용하여 일련의 공정을 처리하는 응용예의 도식도.4 is a schematic diagram of an application of processing a series of processes using the processing apparatus shown in FIG.

Claims (6)

습식처리장치에 있어서, 가공할 시료를 그 표면이 아래를 향하도록 흡착고정시키는 진공척; 상기 진공척을 회전시키기 위한 구동수단; 상기 시료의 표면을 향해 처리액이 압출되게 하는 압출관이 설치되어 있으며, 그 압출관으로 부터 압출된 후 시료표면에 반사되어 낙하되는 처리액을 수용하는 용기; 및 상기 용기에 수용되어진 처리액을 연속적으로 회수하여 온도조절 및 정제시키고 이를 상기 압출관으로 압송시키기 위한 처리액 공급수단, 을 구비하여 에칭액 또는 세정액 등의 처리액이 수직상방으로 분무되도록 구성한 것을 특징으로 하는 습식처리장치.CLAIMS 1. A wet processing apparatus comprising: a vacuum chuck for adsorbing and fixing a sample to be processed to face down; Drive means for rotating the vacuum chuck; An extruding tube is installed to allow the treatment liquid to be extruded toward the surface of the sample, the container containing the treatment liquid which is reflected from the surface of the sample after being extruded from the extrusion tube; And a processing liquid supplying means for continuously recovering the processing liquid contained in the container to adjust and purify the temperature, and to feed the same into the extrusion tube, so that the processing liquid such as an etching liquid or a cleaning liquid is sprayed vertically. Wet processing apparatus. 제1항에 있어서, 상기 압출관이 상기 시료의 회전중심으로부터 편위된 곳에 고정 설치된 것을 특징으로 하는 습식처리장치.The wet processing apparatus according to claim 1, wherein the extrusion tube is fixedly installed at a position offset from the rotational center of the sample. 제1항 또는 제2항중의 어느 한 항에 있어서, 상기 압출관이 상기 용기와 형성되어 된 것을 특징으로 하는 습식처리장치.The wet processing apparatus according to any one of claims 1 to 3, wherein the extrusion tube is formed with the container. 제1항에 있어서, 상기 시료의 이면측에 상기 처리액이나 이물질이 부착되지 않도록 불어내기 위한 가스주입수단을 더 구비하여 구성한 것을 특징으로 하는 습식처리장치.The wet processing apparatus according to claim 1, further comprising gas injection means for blowing the treatment liquid or foreign matter so as not to adhere to the rear surface side of the sample. 제4항에 있어서, 상기 가스주입수단이 압축된 가스공급기와 연결되는 가스주입구가 형성되고 상기 시료의 이면측 가장자리 주위를 둘러싸도록 설치되는 커버로 구성하는 것을 특징으로 하는 습식처리장치.5. The wet processing apparatus according to claim 4, wherein the gas injection means is formed with a cover which is formed so as to surround a peripheral edge of the back side of the sample, and a gas injection port is connected to the compressed gas supplier. 제1항에 있어서, 상기 압출관을 갖는 상기 용기의 복수개의 일렬로 배치하고, 사이 진공척을 상기 구동수단과 함께 이송제어하기 위한 이송수단을 더 구비하여, 일련의 습식처리공정들을 순차적으로 행할 수 있도록 구성한 것을 특징으로 하는 습식처리장치.The apparatus according to claim 1, further comprising transfer means for arranging a plurality of lines of the vessel having the extruded tube and for transferring control between the vacuum chucks together with the drive means to sequentially perform a series of wet treatment processes. Wet processing apparatus, characterized in that configured to be. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910018316A 1991-10-17 1991-10-17 Apparatus for wet treatment KR940002299B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910018316A KR940002299B1 (en) 1991-10-17 1991-10-17 Apparatus for wet treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910018316A KR940002299B1 (en) 1991-10-17 1991-10-17 Apparatus for wet treatment

Publications (2)

Publication Number Publication Date
KR930008972A true KR930008972A (en) 1993-05-22
KR940002299B1 KR940002299B1 (en) 1994-03-21

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KR1019910018316A KR940002299B1 (en) 1991-10-17 1991-10-17 Apparatus for wet treatment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766871A (en) * 1996-11-27 1998-06-16 Food Industry Research And Development Institute Screening and characterization of glutaryl-7-aminocephalosporanic acid acylase

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5766871A (en) * 1996-11-27 1998-06-16 Food Industry Research And Development Institute Screening and characterization of glutaryl-7-aminocephalosporanic acid acylase

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Publication number Publication date
KR940002299B1 (en) 1994-03-21

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