KR930007705Y1 - X-axis cutting apparatus of wafer - Google Patents

X-axis cutting apparatus of wafer Download PDF

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Publication number
KR930007705Y1
KR930007705Y1 KR2019900017331U KR900017331U KR930007705Y1 KR 930007705 Y1 KR930007705 Y1 KR 930007705Y1 KR 2019900017331 U KR2019900017331 U KR 2019900017331U KR 900017331 U KR900017331 U KR 900017331U KR 930007705 Y1 KR930007705 Y1 KR 930007705Y1
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South Korea
Prior art keywords
wafer
axis
ball screw
axis housing
housing
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KR2019900017331U
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Korean (ko)
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KR920010419U (en
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박정근
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금성일렉트론 주식회사
문정환
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Priority to KR2019900017331U priority Critical patent/KR930007705Y1/en
Publication of KR920010419U publication Critical patent/KR920010419U/en
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Publication of KR930007705Y1 publication Critical patent/KR930007705Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmission Devices (AREA)

Abstract

내용 없음.No content.

Description

웨이퍼 절단기의 X축 구동장치X-axis drive of wafer cutting machine

제 1 도는 본 고안 장치를 가진 웨이퍼 절단기의 사시도.1 is a perspective view of a wafer cutting machine having the device of the present invention.

제 2 도는 제 1 도의 평면도.2 is a plan view of FIG.

제 3 도는 종래 웨이퍼 절단기의 사시도.3 is a perspective view of a conventional wafer cutting machine.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 슬라이드 샤프트 2 : X축 하우징1: Slide shaft 2: X axis housing

4 : 볼스크류 5 : 구동 모터4 ball screw 5 drive motor

6 : 커플링6: coupling

본 고안은 원판형으로 제조된 웨이퍼를 각각의 칩(Chip)으로 분리하기 위해 사용되는 웨이퍼 절단기에 관한 것으로, 좀더 구체적으로는 X축의 구동장치를 개선하여 동작의 안정성을 기하고 전체적인 구조가 간단해질수 있게 한 것이다.The present invention relates to a wafer cutting machine used to separate a wafer manufactured in a disc shape into each chip. More specifically, the X-axis driving device is improved to ensure the stability of the operation and the overall structure is simple. It can't help.

종래에 일반적으로 사용되어 온 웨이퍼 절단기는 제 3 도에 도시한 바와 같이 좌, 우 한쌍의 슬라이드 샤프트(11), 양측 슬라이드 샤프트에 끼워진 X축 하우징(12), X축 하우징에 결합된 Z축 구동장치(14) 절단날이 있는 스핀들 메카니즘(13), 동력원이 되는 DC모터(15), DC모터의 구동력을 X축 하우징에 전달하기 위한 감속기(16)와 풀리(17) 및 타이밍 벨트(18), 풀리를 지지하는 베어링 하우징(19), 벨트의 장력 조절을 위한 장력조절장치(20)등으로 구성되어 있다.Conventionally used wafer cutters include a pair of left and right slide shafts 11, an X-axis housing 12 fitted to both slide shafts, and a Z-axis drive coupled to the X-axis housing, as shown in FIG. Device 14 Spindle mechanism 13 with cutting blade, DC motor 15 as a power source, reducer 16 and pulley 17 and timing belt 18 for transmitting the driving force of the DC motor to the X-axis housing , A bearing housing 19 for supporting the pulley, and a tension adjusting device 20 for adjusting the tension of the belt.

따라서 별도 콘트롤러에 의해 DC모터(15)에 전원이 인가되면 모터측이 회전함과 동시에 그 회전력이 감속기(16)를 통해 감속된 상태로 풀리(17)에 전달되어 타이밍 벨트(18)가 회전하게 되고 타이밍 벨트의 회전력에 의해 X축 하우징(12)과 스핀들 매카니즘(13)이 동시에 슬라이드 샤프트(11)를 따라 왕복운동을 하면서 웨이퍼(7)을 각각의 칩으로 절단시킨다.Therefore, when power is applied to the DC motor 15 by a separate controller, the motor side rotates and the rotational force is transmitted to the pulley 17 in a decelerated state through the reducer 16 so that the timing belt 18 rotates. And the X-axis housing 12 and the spindle mechanism 13 reciprocate along the slide shaft 11 at the same time by the rotational force of the timing belt to cut the wafer 7 into individual chips.

그러나 상기한 종래의 장치는 DC모터(15)의 구동력이 풀리(17)와 타이밍 벨트(18)를 통해 X축 하우징(12)에 절단되는 구조이어서 X축 하우징(12) 이동방향이 바뀔 때 타이밍 벨트(18)와 풀리(17)간의 슬립현상이 생겨 동작의 안정성을 기대하기 어렵고, 장시간 사용시 타이밍 벨트(18)가 절단되기 쉬운 결단되기 쉬운 결점이 있다.However, the above-described conventional apparatus has a structure in which the driving force of the DC motor 15 is cut into the X-axis housing 12 through the pulley 17 and the timing belt 18, so that the timing when the moving direction of the X-axis housing 12 changes. Slip phenomenon occurs between the belt 18 and the pulley 17, which makes it difficult to expect the stability of the operation, and there is a defect that the timing belt 18 tends to be easily cut when used for a long time.

또한 각 풀리(17)를 지지하는 베어링 하우징(19)의 배런스가 정확히 맞지 않는 경우 작동의 불안정성은 더욱 커지게 되고 타이밍 벨트(18)의 사용에 따라 소음이 많이 발생되며, 상기한 제반 문제로 인해 기계의 가동율 저하와 생산성의 저하를 초래하게 된다.In addition, when the balance of the bearing housing 19 for supporting each pulley 17 is not exactly matched, the instability of the operation becomes greater and noise is generated by the use of the timing belt 18. This leads to a decrease in the operation rate of the machine and a decrease in productivity.

본 고안은 풀리와 벨트에 의해 동력을 전달하는 종래의 장치와는 달리 볼스크류에 의해 X축 하우징에 동력을 전달시킬 수 있는 장치를 제공하여 상기한 바와 같은 제반 문제점을 해소할 수 있도록 한 것인바, 이를 첨부된 도면 제 1 도 내지 제 2 도를 참조하여 더욱 상세하게 설명하면 다음과 같다.The present invention is to solve the above problems by providing a device that can transmit power to the X-axis housing by a ball screw, unlike the conventional device that transmits power by the pulley and the belt. When described in more detail with reference to the accompanying drawings, FIGS. 1 to 2 as follows.

좌, 우 한쌍의 슬라이드 샤프트(1) 사이에 X축 하우징(2)을 결합하고 그 일측에 스핀들 메카니즘(3)을 설치한 것에 있어서, X축 하우징(2)에 볼스크류(4)를 나사 끼우기로 결합하고 볼스크류(4)의 일측 끝부분에 구동모터(5)를 커플링(6)으로 연결하여 볼스크류(4)의 회전방향에 따라 X축 하우징(2)이 왕복 이동될 수 있게 한 것이다.Screwing the ball screw 4 to the X-axis housing 2, in which the X-axis housing 2 is coupled between a pair of left and right slide shafts 1 and the spindle mechanism 3 is installed on one side thereof. And the drive motor 5 to the one end of the ball screw 4 by the coupling 6 so that the X-axis housing 2 can be reciprocated according to the rotation direction of the ball screw 4. will be.

이와같이 구성된 본 고안은 구동모터(5)가 회전하면 그 회전력이 커플링(6)을 통해 볼스크류(4)에 전달되어 볼스크류(4)가 회전하게 되고 그 회전 방향에 따라 X축 하우징(2)과 스핀들 메카니즘(3)이 동시에 왕복운동을 하면서 웨이퍼(7)를 각각의 칩으로 분리시키게 된다.According to the present invention configured as described above, when the driving motor 5 rotates, the rotational force is transmitted to the ball screw 4 through the coupling 6 so that the ball screw 4 rotates and the X-axis housing 2 according to the rotation direction. ) And the spindle mechanism 3 reciprocate simultaneously to separate the wafer 7 into individual chips.

따라서 종래 구조에서의 풀리, 타이밍 벨트, 감속기, 베어링 하우징, 벨트 장력조절장치 등이 불필요해지고 이에 따라 전체적인 기계의 구조가 매우 간단해지며, 안정적인 작동이 가능해진다.Therefore, the pulley, the timing belt, the speed reducer, the bearing housing, the belt tensioning device, and the like in the conventional structure are unnecessary, and thus the overall machine structure becomes very simple and stable operation is possible.

또한 종래와 같이 벨트의 절단이나 베어링 하우징의 언밸런스 등으로 인한 기계의 동작 정지 시간이 없어지게 되고 가동율의 향상과 생산성의 향상을 가져오게 되며, 구동 소음도 줄일 수 있게 된다.In addition, the machine stops down time due to the cutting of the belt or the unbalance of the bearing housing as in the prior art, resulting in the improvement of the operation rate and the productivity, and the driving noise.

Claims (1)

좌, 우 한쌍의 슬라이드 샤프트(1) 사이에 X축 하우징(2)를 결합하고 그 일측에 스핀들 메카니즘(3)을 설치한 것에 있어서, X축 하우징(2)에 볼스크류(4)를 나사 끼우기로 결합하고 볼스크류(4)의 일측 끝부분에 구동모터(5)를 커플링(6)으로 연결하여 볼스크류(4)의 회전방향에 따라 X축 하우징(2)이 왕복 이동될 수 있게 함을 특징으로 하는 웨이퍼 절단기의 X축 구동장치.Screwing the ball screw 4 to the X-axis housing 2, in which the X-axis housing 2 is coupled between a pair of left and right slide shafts 1 and the spindle mechanism 3 is installed on one side thereof. And the drive motor 5 to the one end of the ball screw (4) by coupling (6) to allow the X-axis housing (2) to reciprocate in accordance with the rotation direction of the ball screw (4) X-axis drive device of the wafer cutter, characterized in that.
KR2019900017331U 1990-11-12 1990-11-12 X-axis cutting apparatus of wafer KR930007705Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900017331U KR930007705Y1 (en) 1990-11-12 1990-11-12 X-axis cutting apparatus of wafer

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Application Number Priority Date Filing Date Title
KR2019900017331U KR930007705Y1 (en) 1990-11-12 1990-11-12 X-axis cutting apparatus of wafer

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KR920010419U KR920010419U (en) 1992-06-17
KR930007705Y1 true KR930007705Y1 (en) 1993-11-12

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