KR930005669U - 엠보스형 테이프 - Google Patents

엠보스형 테이프

Info

Publication number
KR930005669U
KR930005669U KR2019920014694U KR920014694U KR930005669U KR 930005669 U KR930005669 U KR 930005669U KR 2019920014694 U KR2019920014694 U KR 2019920014694U KR 920014694 U KR920014694 U KR 920014694U KR 930005669 U KR930005669 U KR 930005669U
Authority
KR
South Korea
Prior art keywords
embossed tape
embossed
tape
Prior art date
Application number
KR2019920014694U
Other languages
English (en)
Other versions
KR0133581Y1 (ko
Inventor
기요따까 오가사와라
Original Assignee
니뽄 덴끼 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니뽄 덴끼 가부시끼가이샤 filed Critical 니뽄 덴끼 가부시끼가이샤
Publication of KR930005669U publication Critical patent/KR930005669U/ko
Application granted granted Critical
Publication of KR0133581Y1 publication Critical patent/KR0133581Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733Overhead conveying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Packages (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
KR2019920014694U 1991-08-07 1992-08-06 엠보스형 테이프 KR0133581Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP062259U JPH0516690U (ja) 1991-08-07 1991-08-07 半導体装置エンボステーピング用エンボステープ
JP91-62259 1991-08-07

Publications (2)

Publication Number Publication Date
KR930005669U true KR930005669U (ko) 1993-03-22
KR0133581Y1 KR0133581Y1 (ko) 1999-03-20

Family

ID=13194974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920014694U KR0133581Y1 (ko) 1991-08-07 1992-08-06 엠보스형 테이프

Country Status (2)

Country Link
JP (1) JPH0516690U (ko)
KR (1) KR0133581Y1 (ko)

Also Published As

Publication number Publication date
KR0133581Y1 (ko) 1999-03-20
JPH0516690U (ja) 1993-03-02

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