KR930003334A - Structure of support ring of tape - Google Patents

Structure of support ring of tape Download PDF

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Publication number
KR930003334A
KR930003334A KR1019910012836A KR910012836A KR930003334A KR 930003334 A KR930003334 A KR 930003334A KR 1019910012836 A KR1019910012836 A KR 1019910012836A KR 910012836 A KR910012836 A KR 910012836A KR 930003334 A KR930003334 A KR 930003334A
Authority
KR
South Korea
Prior art keywords
support ring
tape
encapsulation
edge
edge portion
Prior art date
Application number
KR1019910012836A
Other languages
Korean (ko)
Other versions
KR940008332B1 (en
Inventor
윤진현
김선환
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910012836A priority Critical patent/KR940008332B1/en
Publication of KR930003334A publication Critical patent/KR930003334A/en
Application granted granted Critical
Publication of KR940008332B1 publication Critical patent/KR940008332B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

내용 없음.No content.

Description

테이프의 서포트링의 구조Structure of support ring of tape

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 따른 탭구성을 보여주는 평면도,2 is a plan view showing a tab configuration according to the present invention,

제3도의 (A)는 제2도에서 테이프의 모서리부분의 구조를 보여주는 확대도,Figure 3 (A) is an enlarged view showing the structure of the edge portion of the tape in Figure 2,

제3도의 (B)는 본 발명에 따른 도포상태를 보여주는 상세도.Figure 3 (B) is a detailed view showing the application state according to the present invention.

Claims (2)

반도체의 인캡슐레이션공정에 사용되는 테이프의 서포트링에 있어서, 상기 서포트링의 모서리 부분이 복수개의 굴곡면의 굴곡면을 가짐을 특징으로 하는 인캡슐레이션 테이프의 서포트링.A support ring for a tape used in an encapsulation process of a semiconductor, wherein an edge portion of the support ring has a curved surface of a plurality of curved surfaces. 제1항에 있어서, 상기 서포트링의 모서리부분이 칩으로부터 0.1∼0.5㎜의 거리에 있음을 특징으로 하는 인캡슐레이션 테이프의 서포트링.The support ring of an encapsulation tape according to claim 1, wherein an edge of the support ring is at a distance of 0.1 to 0.5 mm from a chip. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910012836A 1991-07-25 1991-07-25 Semiconductor package with effective support ring structure KR940008332B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910012836A KR940008332B1 (en) 1991-07-25 1991-07-25 Semiconductor package with effective support ring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910012836A KR940008332B1 (en) 1991-07-25 1991-07-25 Semiconductor package with effective support ring structure

Publications (2)

Publication Number Publication Date
KR930003334A true KR930003334A (en) 1993-02-24
KR940008332B1 KR940008332B1 (en) 1994-09-12

Family

ID=19317811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910012836A KR940008332B1 (en) 1991-07-25 1991-07-25 Semiconductor package with effective support ring structure

Country Status (1)

Country Link
KR (1) KR940008332B1 (en)

Also Published As

Publication number Publication date
KR940008332B1 (en) 1994-09-12

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