KR920703338A - 땜납 또는 도체 페이스트 인쇄 장치 - Google Patents

땜납 또는 도체 페이스트 인쇄 장치

Info

Publication number
KR920703338A
KR920703338A KR1019920701693A KR920701693A KR920703338A KR 920703338 A KR920703338 A KR 920703338A KR 1019920701693 A KR1019920701693 A KR 1019920701693A KR 920701693 A KR920701693 A KR 920701693A KR 920703338 A KR920703338 A KR 920703338A
Authority
KR
South Korea
Prior art keywords
frame
solder
plate
conductor paste
paste printing
Prior art date
Application number
KR1019920701693A
Other languages
English (en)
Korean (ko)
Inventor
쥐르그 홀데레게르
Original Assignee
원본미기재
피알에스에스-마쉬넨 에이지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 피알에스에스-마쉬넨 에이지 filed Critical 원본미기재
Priority claimed from PCT/CH1991/000224 external-priority patent/WO1992008616A1/fr
Publication of KR920703338A publication Critical patent/KR920703338A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F27/00—Devices for attaching printing elements or formes to supports
    • B41F27/08—Devices for attaching printing elements or formes to supports for attaching printing formes to flat type-beds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Plates And Materials Therefor (AREA)
KR1019920701693A 1990-11-19 1991-11-01 땜납 또는 도체 페이스트 인쇄 장치 KR920703338A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CH3664/90-6 1990-11-19
CH366490 1990-11-19
DE9017591U DE9017591U1 (de) 1990-11-19 1990-12-31 Vorrichtung für den Löt- oder Leitpastendruck
DEG9017591.3V 1990-12-31
PCT/CH1991/000224 WO1992008616A1 (fr) 1990-11-19 1991-11-01 Dispositif pour l'impression de pate a souder ou de pate conductrice

Publications (1)

Publication Number Publication Date
KR920703338A true KR920703338A (ko) 1992-12-17

Family

ID=4260859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920701693A KR920703338A (ko) 1990-11-19 1991-11-01 땜납 또는 도체 페이스트 인쇄 장치

Country Status (2)

Country Link
KR (1) KR920703338A (fr)
DE (2) DE9017591U1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264460B (en) * 1992-06-03 1994-02-16 David Godfrey Williams Improved stencil or mask for applying solder to circuit boards and support frame

Also Published As

Publication number Publication date
DE9017591U1 (de) 1991-04-04
DE59104502D1 (de) 1995-03-16

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid