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Priority to KR1019910006529ApriorityCriticalpatent/KR920019470A/en
Publication of KR920019470ApublicationCriticalpatent/KR920019470A/en
할라이드와 계면활성제를 첨가하지 않은 납땜공정에 사용하는 무세척 후락스 조성물No-clean flax composition for use in soldering processes without addition of halides and surfactants
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (1)
본문에서 설명한 바와같이 이소프로필 알콜 90-97%, 물 0-3%, 디 카르복실산 1-3%, 레신산 0.5-2%을 용해시켜 제조한 할라이드와 계면활성제를 첨가하지 않은 납땜공정에 사용하는 무세척 후락스 조성물.As described in the text, the soldering process does not add halides and surfactants prepared by dissolving 90-97% isopropyl alcohol, 0-3% water, 1-3% dicarboxylic acid, and 0.5-2% resin acid. The no-clean flax composition used.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910006529A1991-04-241991-04-24
No-clean flax composition for use in soldering processes without addition of halides and surfactants
KR920019470A
(en)