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Application filed by 김광호, 삼성전자 주식회사filedCritical김광호
Priority to KR1019910002033ApriorityCriticalpatent/KR920016985A/en
Publication of KR920016985ApublicationCriticalpatent/KR920016985A/en
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도의 (가), (나)는 이 발명에 따른 실시예를 나타낸 도면, 제3도의 (가), (나)는 이 발명에 따른 다른 실시예를 나타낸 도면이다.(A) and (b) of FIG. 2 show an embodiment according to the present invention, and (a) and (b) of FIG. 3 show another embodiment according to the present invention.
Claims (1)
본체부와 뚜껑부로 결합되는 반도체 카드 패키지 장치에 있어서, 본체부(1)와 대응되어 결합되는 뚜껑부(5) 각각의 표면에 복수개의 통기공(7a)을 소정간격으로 형성하여 패키지 내부의 열이 방출되도록한 것을 특징으로 하는 반도체 카드 패키지 장치.In the semiconductor card package device coupled to the main body portion and the lid portion, a plurality of vent holes (7a) are formed on the surface of each of the lid portion 5 coupled to the main body portion (1) at predetermined intervals to heat the inside of the package. The semiconductor card package device, characterized in that the discharge.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.