KR920015751U - Lead frame manufacturing equipment - Google Patents

Lead frame manufacturing equipment

Info

Publication number
KR920015751U
KR920015751U KR2019910000034U KR910000034U KR920015751U KR 920015751 U KR920015751 U KR 920015751U KR 2019910000034 U KR2019910000034 U KR 2019910000034U KR 910000034 U KR910000034 U KR 910000034U KR 920015751 U KR920015751 U KR 920015751U
Authority
KR
South Korea
Prior art keywords
lead frame
manufacturing equipment
frame manufacturing
equipment
lead
Prior art date
Application number
KR2019910000034U
Other languages
Korean (ko)
Other versions
KR960009286Y1 (en
Inventor
임호섭
하달수
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019910000034U priority Critical patent/KR960009286Y1/en
Publication of KR920015751U publication Critical patent/KR920015751U/en
Application granted granted Critical
Publication of KR960009286Y1 publication Critical patent/KR960009286Y1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67121Apparatus for making assemblies not otherwise provided for, e.g. package constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Punching Or Piercing (AREA)
KR2019910000034U 1991-01-04 1991-01-04 Manufacturing apparatus for a lead frame KR960009286Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910000034U KR960009286Y1 (en) 1991-01-04 1991-01-04 Manufacturing apparatus for a lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910000034U KR960009286Y1 (en) 1991-01-04 1991-01-04 Manufacturing apparatus for a lead frame

Publications (2)

Publication Number Publication Date
KR920015751U true KR920015751U (en) 1992-08-17
KR960009286Y1 KR960009286Y1 (en) 1996-10-16

Family

ID=19309457

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910000034U KR960009286Y1 (en) 1991-01-04 1991-01-04 Manufacturing apparatus for a lead frame

Country Status (1)

Country Link
KR (1) KR960009286Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100530753B1 (en) * 1998-04-10 2006-01-27 삼성테크윈 주식회사 Lead frame pressing mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100530753B1 (en) * 1998-04-10 2006-01-27 삼성테크윈 주식회사 Lead frame pressing mold

Also Published As

Publication number Publication date
KR960009286Y1 (en) 1996-10-16

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050930

Year of fee payment: 10

EXPY Expiration of term