KR920013703U - Magazine used in semiconductor assembly process - Google Patents

Magazine used in semiconductor assembly process

Info

Publication number
KR920013703U
KR920013703U KR2019900020139U KR900020139U KR920013703U KR 920013703 U KR920013703 U KR 920013703U KR 2019900020139 U KR2019900020139 U KR 2019900020139U KR 900020139 U KR900020139 U KR 900020139U KR 920013703 U KR920013703 U KR 920013703U
Authority
KR
South Korea
Prior art keywords
assembly process
semiconductor assembly
magazine used
magazine
semiconductor
Prior art date
Application number
KR2019900020139U
Other languages
Korean (ko)
Other versions
KR960005589Y1 (en
Inventor
김훈
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900020139U priority Critical patent/KR960005589Y1/en
Publication of KR920013703U publication Critical patent/KR920013703U/en
Application granted granted Critical
Publication of KR960005589Y1 publication Critical patent/KR960005589Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Die Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019900020139U 1990-12-18 1990-12-18 Magazine using semiconductor assembly process KR960005589Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900020139U KR960005589Y1 (en) 1990-12-18 1990-12-18 Magazine using semiconductor assembly process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900020139U KR960005589Y1 (en) 1990-12-18 1990-12-18 Magazine using semiconductor assembly process

Publications (2)

Publication Number Publication Date
KR920013703U true KR920013703U (en) 1992-07-27
KR960005589Y1 KR960005589Y1 (en) 1996-07-06

Family

ID=19307209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900020139U KR960005589Y1 (en) 1990-12-18 1990-12-18 Magazine using semiconductor assembly process

Country Status (1)

Country Link
KR (1) KR960005589Y1 (en)

Also Published As

Publication number Publication date
KR960005589Y1 (en) 1996-07-06

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J2X1 Appeal (before the patent court)

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E902 Notification of reason for refusal
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20040618

Year of fee payment: 9

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