KR920010423U - Dual package structure with double-sided thin film circuit board - Google Patents

Dual package structure with double-sided thin film circuit board

Info

Publication number
KR920010423U
KR920010423U KR2019900017385U KR900017385U KR920010423U KR 920010423 U KR920010423 U KR 920010423U KR 2019900017385 U KR2019900017385 U KR 2019900017385U KR 900017385 U KR900017385 U KR 900017385U KR 920010423 U KR920010423 U KR 920010423U
Authority
KR
South Korea
Prior art keywords
double
circuit board
thin film
package structure
film circuit
Prior art date
Application number
KR2019900017385U
Other languages
Korean (ko)
Other versions
KR930007920Y1 (en
Inventor
김대성
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019900017385U priority Critical patent/KR930007920Y1/en
Publication of KR920010423U publication Critical patent/KR920010423U/en
Application granted granted Critical
Publication of KR930007920Y1 publication Critical patent/KR930007920Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
KR2019900017385U 1990-11-13 1990-11-13 Double package structure having both side thin film KR930007920Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900017385U KR930007920Y1 (en) 1990-11-13 1990-11-13 Double package structure having both side thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900017385U KR930007920Y1 (en) 1990-11-13 1990-11-13 Double package structure having both side thin film

Publications (2)

Publication Number Publication Date
KR920010423U true KR920010423U (en) 1992-06-17
KR930007920Y1 KR930007920Y1 (en) 1993-11-24

Family

ID=19305338

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900017385U KR930007920Y1 (en) 1990-11-13 1990-11-13 Double package structure having both side thin film

Country Status (1)

Country Link
KR (1) KR930007920Y1 (en)

Also Published As

Publication number Publication date
KR930007920Y1 (en) 1993-11-24

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Payment date: 20021018

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