KR920010405U - Epoxy tool fixing device for semiconductor manufacturing - Google Patents
Epoxy tool fixing device for semiconductor manufacturingInfo
- Publication number
- KR920010405U KR920010405U KR2019900018612U KR900018612U KR920010405U KR 920010405 U KR920010405 U KR 920010405U KR 2019900018612 U KR2019900018612 U KR 2019900018612U KR 900018612 U KR900018612 U KR 900018612U KR 920010405 U KR920010405 U KR 920010405U
- Authority
- KR
- South Korea
- Prior art keywords
- fixing device
- semiconductor manufacturing
- tool fixing
- epoxy tool
- epoxy
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Coating Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900018612U KR930005546Y1 (en) | 1990-11-29 | 1990-11-29 | Epoxy tool fixing apparatus of semiconductor manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019900018612U KR930005546Y1 (en) | 1990-11-29 | 1990-11-29 | Epoxy tool fixing apparatus of semiconductor manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920010405U true KR920010405U (en) | 1992-06-17 |
KR930005546Y1 KR930005546Y1 (en) | 1993-08-23 |
Family
ID=19306154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019900018612U KR930005546Y1 (en) | 1990-11-29 | 1990-11-29 | Epoxy tool fixing apparatus of semiconductor manufacture |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930005546Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100294694B1 (en) * | 1998-12-29 | 2001-08-30 | 김영환 | multi-needle dispenser for potting process in fabrication of TCP |
-
1990
- 1990-11-29 KR KR2019900018612U patent/KR930005546Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100294694B1 (en) * | 1998-12-29 | 2001-08-30 | 김영환 | multi-needle dispenser for potting process in fabrication of TCP |
Also Published As
Publication number | Publication date |
---|---|
KR930005546Y1 (en) | 1993-08-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20020716 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |