KR920008855A - Wafer surface polishing - Google Patents

Wafer surface polishing

Info

Publication number
KR920008855A
KR920008855A KR1019900016180A KR900016180A KR920008855A KR 920008855 A KR920008855 A KR 920008855A KR 1019900016180 A KR1019900016180 A KR 1019900016180A KR 900016180 A KR900016180 A KR 900016180A KR 920008855 A KR920008855 A KR 920008855A
Authority
KR
South Korea
Prior art keywords
wafer surface
surface polishing
polishing
wafer
Prior art date
Application number
KR1019900016180A
Other languages
Korean (ko)
Other versions
KR930003270B1 (en
Inventor
이재호
송운영
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR1019900016180A priority Critical patent/KR930003270B1/en
Publication of KR920008855A publication Critical patent/KR920008855A/en
Application granted granted Critical
Publication of KR930003270B1 publication Critical patent/KR930003270B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019900016180A 1990-10-12 1990-10-12 Polishing method of wafer surface KR930003270B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900016180A KR930003270B1 (en) 1990-10-12 1990-10-12 Polishing method of wafer surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900016180A KR930003270B1 (en) 1990-10-12 1990-10-12 Polishing method of wafer surface

Publications (2)

Publication Number Publication Date
KR920008855A true KR920008855A (en) 1992-05-28
KR930003270B1 KR930003270B1 (en) 1993-04-24

Family

ID=19304559

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900016180A KR930003270B1 (en) 1990-10-12 1990-10-12 Polishing method of wafer surface

Country Status (1)

Country Link
KR (1) KR930003270B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102142301B1 (en) 2018-12-12 2020-08-11 주식회사 포스코 Polishing apparatus

Also Published As

Publication number Publication date
KR930003270B1 (en) 1993-04-24

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20070327

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee