KR920007035U - Transfer head - Google Patents

Transfer head

Info

Publication number
KR920007035U
KR920007035U KR2019900014434U KR900014434U KR920007035U KR 920007035 U KR920007035 U KR 920007035U KR 2019900014434 U KR2019900014434 U KR 2019900014434U KR 900014434 U KR900014434 U KR 900014434U KR 920007035 U KR920007035 U KR 920007035U
Authority
KR
South Korea
Prior art keywords
transfer head
transfer
head
Prior art date
Application number
KR2019900014434U
Other languages
Korean (ko)
Other versions
KR930004534Y1 (en
Inventor
이희준
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019900014434U priority Critical patent/KR930004534Y1/en
Publication of KR920007035U publication Critical patent/KR920007035U/en
Application granted granted Critical
Publication of KR930004534Y1 publication Critical patent/KR930004534Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
KR2019900014434U 1990-09-19 1990-09-19 Transfer head KR930004534Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900014434U KR930004534Y1 (en) 1990-09-19 1990-09-19 Transfer head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900014434U KR930004534Y1 (en) 1990-09-19 1990-09-19 Transfer head

Publications (2)

Publication Number Publication Date
KR920007035U true KR920007035U (en) 1992-04-22
KR930004534Y1 KR930004534Y1 (en) 1993-07-21

Family

ID=19303533

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900014434U KR930004534Y1 (en) 1990-09-19 1990-09-19 Transfer head

Country Status (1)

Country Link
KR (1) KR930004534Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100921652B1 (en) * 2008-10-09 2009-10-14 주식회사 고려반도체시스템 Control method of picker apparatus of semiconductor element for tranportation

Also Published As

Publication number Publication date
KR930004534Y1 (en) 1993-07-21

Similar Documents

Publication Publication Date Title
DE69315740D1 (en) Data transfer head
FI931271A (en) STOELDSKYDD FOER FOERVARINGSFODRAL TILL LASERSKIVA
FI932535A (en) Trycoeverfoerare en djupning Foer spaenningsisolering
ATA150090A (en) HOERGERAET
FI932669A (en) Flerpoligt skaermat kontaktdon med gemensam jord
DE69115665D1 (en) PRINT HEAD
DE69207785D1 (en) Heating head
FI930560A (en) NAETDRIVEN MED FASSKAERNINGSKONTROLL UTRUSTAD KOPPLING
DE69130367D1 (en) Transfer printer
ATA139792A (en) COOLER ARRANGEMENT
DE69207560D1 (en) Antidiabetic
FI930132A0 (en) AVBOEJNINGSSYSTEM MED EN KONTROLLERAD STRAOLPUNKT
DE69212286D1 (en) Cooler
FI942259A0 (en) Heat
FI932076A0 (en) HAEVSYSTEM MED EN INBYGGD GASFJAEDER
DK56591D0 (en) TOURNESS PROCEDURES
DE59205535D1 (en) Concave
DE69105528D1 (en) Thermal head.
KR920007035U (en) Transfer head
FI932843A (en) PSYLLIUM- OCH KOLESTYRAMINKOMPOSITIONER MED FOERBAETTRAD SMAKLIGHET
NO932219D0 (en) PESTICIDING RELATIONSHIPS
KR920011226U (en) Sanitary head
KR920019109U (en) still
DE69119522D1 (en) TRANSFER PROCEDURE
KR900010697U (en) Head transfer device

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 19980716

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee