KR920003408U - 반도체 부품조립용 액상재료(material)분배 주입장치 - Google Patents

반도체 부품조립용 액상재료(material)분배 주입장치

Info

Publication number
KR920003408U
KR920003408U KR2019900010405U KR900010405U KR920003408U KR 920003408 U KR920003408 U KR 920003408U KR 2019900010405 U KR2019900010405 U KR 2019900010405U KR 900010405 U KR900010405 U KR 900010405U KR 920003408 U KR920003408 U KR 920003408U
Authority
KR
South Korea
Prior art keywords
dispensing
semiconductor parts
assembling semiconductor
dispensing device
liquid material
Prior art date
Application number
KR2019900010405U
Other languages
English (en)
Other versions
KR930002839Y1 (ko
Inventor
정지영
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019900010405U priority Critical patent/KR930002839Y1/ko
Publication of KR920003408U publication Critical patent/KR920003408U/ko
Application granted granted Critical
Publication of KR930002839Y1 publication Critical patent/KR930002839Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019900010405U 1990-07-16 1990-07-16 반도체 부품조립용 액상재료(material)분배 주입장치 KR930002839Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900010405U KR930002839Y1 (ko) 1990-07-16 1990-07-16 반도체 부품조립용 액상재료(material)분배 주입장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900010405U KR930002839Y1 (ko) 1990-07-16 1990-07-16 반도체 부품조립용 액상재료(material)분배 주입장치

Publications (2)

Publication Number Publication Date
KR920003408U true KR920003408U (ko) 1992-02-25
KR930002839Y1 KR930002839Y1 (ko) 1993-05-22

Family

ID=19301080

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900010405U KR930002839Y1 (ko) 1990-07-16 1990-07-16 반도체 부품조립용 액상재료(material)분배 주입장치

Country Status (1)

Country Link
KR (1) KR930002839Y1 (ko)

Also Published As

Publication number Publication date
KR930002839Y1 (ko) 1993-05-22

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