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Application filed by 김광호, 삼성전자 주식회사filedCritical김광호
Priority to KR1019900007804ApriorityCriticalpatent/KR910019858A/en
Publication of KR910019858ApublicationCriticalpatent/KR910019858A/en
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명의 모듈의 포장방법을 설형하기 위한 도면이다.3 is a view for explaining the packaging method of the module of the present invention.
Claims (1)
모듈 (2)을 관형튜브(1)내에 포장하는 방법에 있어서, U자형 홈을 갖는 정전기 흡수용 고무(SE)를 형성하되 그 길이(LS)를 관형튜브(1)의 길이(LT)보다 약간 짧게 형성하고, 상기 정전기 흡수용 고무(SE)의 U자형 홈에 IC각 착설된 PCE(2;모듈)의 일측선단에 끼우고, 다수의 모듈(2)을 상기 정전기 흡수용 고무(SE)의 U자형 홈에 끼운 다음 관형튜브(1)내에 삽입하여 포장하는 모듈의 포장방법.In the method of packaging the module (2) in the tubular tube (1), the electrostatic absorbing rubber (SE) having a U-shaped groove is formed, but the length (L S ) is the length (L T ) of the tubular tube (1). It is formed slightly shorter, and is inserted in the U-shaped groove of the electrostatic absorbing rubber (SE) at one end of the PCE (2; module) mounted on each IC, and the plurality of modules (2) are inserted into the electrostatic absorbing rubber (SE). The packaging method of the module that is inserted into the U-shaped groove of the) and then inserted into the tubular tube (1) and packed.※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: This is to be disclosed by the original application.
KR1019900007804A1990-05-291990-05-29
Packing method of module
KR910019858A
(en)