KR910018942A - Thin film IC card - Google Patents

Thin film IC card Download PDF

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Publication number
KR910018942A
KR910018942A KR1019900005827A KR900005827A KR910018942A KR 910018942 A KR910018942 A KR 910018942A KR 1019900005827 A KR1019900005827 A KR 1019900005827A KR 900005827 A KR900005827 A KR 900005827A KR 910018942 A KR910018942 A KR 910018942A
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KR
South Korea
Prior art keywords
thin film
card according
film
card
thin
Prior art date
Application number
KR1019900005827A
Other languages
Korean (ko)
Other versions
KR940006122B1 (en
Inventor
김대원
Original Assignee
강진구
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 강진구, 삼성전자 주식회사 filed Critical 강진구
Priority to KR1019900005827A priority Critical patent/KR940006122B1/en
Publication of KR910018942A publication Critical patent/KR910018942A/en
Application granted granted Critical
Publication of KR940006122B1 publication Critical patent/KR940006122B1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Thin Film Transistor (AREA)

Abstract

내용 없음No content

Description

박막 IC카드Thin film IC card

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 의한 IC카드의 일실시예로서, (가)는 IC카드의 구조도이고, (나)는 박막 IC기판의 단면도이다.3 is an embodiment of the IC card according to the present invention. (A) is a structural diagram of the IC card, and (B) is a sectional view of the thin film IC substrate.

Claims (6)

박막 IC카드에 있어서, 전기적 절연성을 갖는 박막 IC기판에 CUP 및 메모리 회로를 구성한 박막 트랜지스터와, 외부접속단자가 함께 형성된 것을 특징으로 하는 박막 IC카드.A thin film IC card comprising: a thin film transistor comprising a CUP and a memory circuit and an external connection terminal formed on a thin film IC substrate having electrical insulation. 제1항에 있어서, 상기 박막트랜지스터를 구성하는 반도체 재료로 비정질 실리콘 또는 비정질 실리콘을 레이저로 재결정화한 것을 특징으로 하는 박막 IC카드.The thin film IC card according to claim 1, wherein amorphous silicon or amorphous silicon is recrystallized with a laser as a semiconductor material constituting the thin film transistor. 제1항에 있어서, 상기 박막 IC기판(34)의 금속 박판(41)위에 절연막(42)을 입힌 것을 특징으로 하는 박막 IC카드.The thin film IC card according to claim 1, wherein an insulating film (42) is coated on the metal thin plate (41) of the thin film IC substrate (34). 제3항에 있어서, 상기 금속박판(41)의 재료가 스테인레스스틸인 것을 특징으로 하는 박막 IC카드.4. The thin film IC card according to claim 3, wherein the metal thin plate (41) is made of stainless steel. 제3항에 있어서, 상기 절연막(42)이 폴리아미드와 같은 내열성 고분자나 산화실리콘과 같은 유전체로 된 것을 특징으로 하는 박막 IC카드.4. The thin film IC card according to claim 3, wherein the insulating film (42) is made of a heat resistant polymer such as polyamide or a dielectric such as silicon oxide. 제1항에 있어서, 상기 외부 접속단자(33)를 형성할 때 상기 단자용 금속막(50) 중에서 상기 박막소자 부분위에 입혀진 그목막은 제거하지 않고 남기도록 한 것을 특징으로 하는 박막 IC카드.The thin film IC card according to claim 1, wherein, when the external connection terminal (33) is formed, the film coated on the thin film element portion of the terminal metal film (50) is left without being removed. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900005827A 1990-04-25 1990-04-25 Thin layer ic card KR940006122B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900005827A KR940006122B1 (en) 1990-04-25 1990-04-25 Thin layer ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900005827A KR940006122B1 (en) 1990-04-25 1990-04-25 Thin layer ic card

Publications (2)

Publication Number Publication Date
KR910018942A true KR910018942A (en) 1991-11-30
KR940006122B1 KR940006122B1 (en) 1994-07-06

Family

ID=19298360

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900005827A KR940006122B1 (en) 1990-04-25 1990-04-25 Thin layer ic card

Country Status (1)

Country Link
KR (1) KR940006122B1 (en)

Also Published As

Publication number Publication date
KR940006122B1 (en) 1994-07-06

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