KR910010673A - How to remove bubbles in coating solution - Google Patents

How to remove bubbles in coating solution Download PDF

Info

Publication number
KR910010673A
KR910010673A KR1019890016391A KR890016391A KR910010673A KR 910010673 A KR910010673 A KR 910010673A KR 1019890016391 A KR1019890016391 A KR 1019890016391A KR 890016391 A KR890016391 A KR 890016391A KR 910010673 A KR910010673 A KR 910010673A
Authority
KR
South Korea
Prior art keywords
coating solution
remove bubbles
bubbles
remove
stirred
Prior art date
Application number
KR1019890016391A
Other languages
Korean (ko)
Other versions
KR920009705B1 (en
Inventor
이성우
Original Assignee
정몽헌
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정몽헌, 현대전자산업 주식회사 filed Critical 정몽헌
Priority to KR1019890016391A priority Critical patent/KR920009705B1/en
Publication of KR910010673A publication Critical patent/KR910010673A/en
Application granted granted Critical
Publication of KR920009705B1 publication Critical patent/KR920009705B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Coating Apparatus (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

내용 없음No content

Description

코팅용액속의 기포 제거방법How to remove bubbles in coating solution

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 비이커에 혼한 코팅용액을 넣고 교반시키는 경우 기포가 발생된 상태를 나타낸 도면.1 is a view showing a state in which bubbles are generated when the mixed coating solution mixed in the beaker and stirred.

제2도는 I.C의 단면을 나타낸 도면.2 shows a cross section of I.C.

제3도는 코팅용액에 발생된 기포를 제거하기 위해서 진공펌프를 연결한 상태의 도면.3 is a view in which a vacuum pump is connected to remove bubbles generated in the coating solution.

Claims (1)

반도체 제조공정에 있어서, 예정된 양의 코팅요액을 교반시킨후에 상기의 혼합된 코팅용액을 진공펌프에 접속된 다수의 용기내에서 500㎜Hg정도의 저진공상태로 처리하여 기포를 제거하는 것을 특징으로 하는 코팅용액속의 기포 제거방법.In the semiconductor manufacturing process, after a predetermined amount of coating solution is stirred, the mixed coating solution is treated in a low vacuum state of about 500 mmHg in a plurality of containers connected to a vacuum pump to remove bubbles. Method of removing bubbles in the coating solution. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890016391A 1989-11-13 1989-11-13 Method of removal bubble in the coating solution KR920009705B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890016391A KR920009705B1 (en) 1989-11-13 1989-11-13 Method of removal bubble in the coating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890016391A KR920009705B1 (en) 1989-11-13 1989-11-13 Method of removal bubble in the coating solution

Publications (2)

Publication Number Publication Date
KR910010673A true KR910010673A (en) 1991-06-29
KR920009705B1 KR920009705B1 (en) 1992-10-22

Family

ID=19291567

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890016391A KR920009705B1 (en) 1989-11-13 1989-11-13 Method of removal bubble in the coating solution

Country Status (1)

Country Link
KR (1) KR920009705B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101495088B1 (en) * 2013-12-09 2015-02-24 코닝정밀소재 주식회사 Method of fabricating film for optoelectronics

Also Published As

Publication number Publication date
KR920009705B1 (en) 1992-10-22

Similar Documents

Publication Publication Date Title
KR890007407A (en) Spin-on Glass for Semiconductor Processing
DE3771948D1 (en) PRODUCTION OF VERY PURE, HOMOGENEOUS ZIRCONOXIDE MIXTURES.
DE69001609D1 (en) PRODUCTION OF LOW-VISCOSITY SMALL PARTICLE DISPERSIONS IN GELATINE.
DE69016360D1 (en) Removal of trialkylarenes from fluids.
KR870000031A (en) Extraction method of Korean ginseng extract
KR850005009A (en) Etching Method
DE3768876D1 (en) COMPOSITION FOR THE PRODUCTION OF INTEGRATED CIRCUITS, APPLICATION AND PRODUCTION METHOD.
KR970077287A (en) Method of processing semiconductor material
KR910010673A (en) How to remove bubbles in coating solution
DE69018307T2 (en) Process for the production of contacts in semiconductor components.
DE3781955T2 (en) EXTRACTION OF HYDROFLUORINE FROM 2,2,3,3-TETRAFLUOROXETANE.
DE261607T1 (en) BIOCIDES FOR THE TREATMENT OF COMMERCIAL WASTEWATER, IN PARTICULAR GAS WASHER SLUDGE.
KR920001649A (en) How to remove polyetch surplus
KR920001650A (en) How to remove photoresist
DE3772237D1 (en) PRODUCTION OF SECONDARY AMERICS FROM OLEFINES AND PRIMAERAMINS.
KR880000353A (en) Manufacturing method of semiconductor material
KR920001653A (en) How to remove photoresist
DE3784877D1 (en) METHOD OF PRODUCING 2,6-DICHLORBENZYL ALCOHOL.
KR910008789A (en) How to remove photoresist on metal layer
KR870007695A (en) Skin Cleaner Manufacturing Method
KR840001814A (en) Manufacturing Method of Samsamjeong
KR840007395A (en) Stabilization Method of Polymer Composition
KR920008976A (en) LDD manufacturing method using the slope of poly electrode
KR900018359A (en) How to prepare
KR870007088A (en) Hyosung fertilizer manufacturing method based on serving

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20040920

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee