KR910010652A - Automatic removal of semiconductor material in insert - Google Patents

Automatic removal of semiconductor material in insert Download PDF

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Publication number
KR910010652A
KR910010652A KR1019890017558A KR890017558A KR910010652A KR 910010652 A KR910010652 A KR 910010652A KR 1019890017558 A KR1019890017558 A KR 1019890017558A KR 890017558 A KR890017558 A KR 890017558A KR 910010652 A KR910010652 A KR 910010652A
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KR
South Korea
Prior art keywords
insert
air cylinder
insert holder
roller
holder
Prior art date
Application number
KR1019890017558A
Other languages
Korean (ko)
Other versions
KR920008840B1 (en
Inventor
공병식
Original Assignee
정몽헌
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 정몽헌, 현대전자산업 주식회사 filed Critical 정몽헌
Priority to KR1019890017558A priority Critical patent/KR920008840B1/en
Publication of KR910010652A publication Critical patent/KR910010652A/en
Application granted granted Critical
Publication of KR920008840B1 publication Critical patent/KR920008840B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

내용 없음No content

Description

인서트내 반도체 자재 자동제거 장치Automatic removal of semiconductor material in insert

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 정면도.1 is a front view of the present invention.

제2도는 제1도의 A-A선을 따라 절취한 상태의 단면도.2 is a cross-sectional view taken along the line A-A of FIG.

제4A도 내지 제4E도는 본 발명의 작동상태를 각 단계별로 도시한 단면도.4A to 4E are cross-sectional views showing operation states of the present invention in each step.

Claims (3)

소정지름 및 측면폭을 갖는 원판형 부재로 이루어진 인서트의 외곽원주면상에 구성된 다수의 자재수용홀내에 수용되어 있는 패캐이지를 제거하는 자재 제거장치에 있어서, 받침대(3)에 고정된 지지대(4)에 일체로 장착되며, 그 내부저면은 정면이 원형인 상기 인서트(1)하부 일부를 수용할 수 있도록 곡면처리하고, 상기 인서트(1)최하단의 자재수용홀(2)과 대응하는 전면부 및 후면부에는 소정면적으로 절개한 절개부(22' 및 22)를 저면곡면부에는 소정면적의 1쌍의 절개부(6')를 각각 형성한 인서트 홀더(6)와, 상기 인서트 홀더(6)에 형성된 1쌍의 저면절개부(6')와 각각 대응하며, 인서트 홀더(6)내에서 상기 인서트(1)저면과 연동되도록 설치된 제1로울러(7)및 제2로울러(8)와, 상기 인서트 홀더(6)전단부의 받침대(3)상에 장착되고, 그 작동부 전단에는 소정길이의 암(16)을 구비하여 그 수직연장부가 회전하는 상기 인서트(1)의 자재수용홀(2)에 대응하도록 구성한 제1에어실더(15)와 상기 인서트 홀더(6)후미의 받침대(3)상에 장착되어 상기 제1에어실린더(15)와 연동하며 그 작동부는 상기 인서트 홀더(6)의 후미절개부(22)를 통하여 상기 인서트(1)최하단의 자재수용홀에 대응할 수 있도록 구성한 제2에어실린더(18)및, 상기 제1에어실린더(15)전단의 받침대(3)상에 장착되어 상기 제1에어실린더(15) 작동부에 대응하며, 상기 제1에어실린더(15)의 작동부와 접촉시 ON 되면서 상기 제2에어실린더(18)를 작동시키는 리미트 스위치(17)와, 소정규격의 튜브가 장착되며, 전단부는 상기 인서트 홀더(6)전면 절개부(22')하부에 볼트로서 고착된 슬라이더 (20)와 연결된 튜브핸들러(19)로 구성된 것을 특징으로 하는 인서트내 반도체 자재 자동제거 장치.A material removing apparatus for removing a package housed in a plurality of material holding holes formed on an outer circumferential surface of an insert made of a disc-shaped member having a predetermined diameter and a side width, the support 4 being fixed to the pedestal 3. It is integrally mounted on the inner bottom surface is curved to accommodate a portion of the lower part of the insert (1) is circular in front, and the front and rear parts corresponding to the material receiving hole (2) at the bottom of the insert (1) An insert holder 6 formed with cutouts 22 'and 22 cut into a predetermined area and a pair of cutouts 6' of a predetermined area are respectively formed in the bottom curved surface portion, and formed in the insert holder 6, respectively. A first roller 7 and a second roller 8 which correspond to a pair of bottom incisions 6 ', respectively, interlocked with the bottom of the insert 1 in the insert holder 6, and the insert holder. (6) Mounted on the pedestal (3) of the front end, the predetermined length of the front end of the operating part On the pedestal 3 on the rear end of the first air cylinder 15 and the insert holder 6 having an arm 16 and configured to correspond to the material receiving hole 2 of the insert 1 in which the vertical extension thereof rotates. A second air which is mounted on and interlocked with the first air cylinder 15 and whose operation part is configured to correspond to the material accommodation hole at the bottom of the insert 1 through the rear incision 22 of the insert holder 6; A cylinder 18 and mounted on a pedestal 3 at the front end of the first air cylinder 15 to correspond to the operation part of the first air cylinder 15, and an operation part of the first air cylinder 15. A limit switch 17 for operating the second air cylinder 18 while being turned on in contact with the tube, and a tube of a predetermined size is mounted, and the front end portion is fixed to the lower portion of the insert holder 6 by a bolt as a bolt. Semiconductor material in the insert, characterized in that it consists of a tube handler (19) connected to the slider (20) Copper removal device. 제1항에 있어서, 상기 제1로울러(7)와 제2로울러(8)는 각각의 회전축(7' 및 8')의 절개부(6')의 전후내면의 삽설되며, 부재의 소정높이가 상기 인서트 홀더(6)내로 돌출되어 상기 인서트(1)저면과 접촉하여 구동부(9)와 벨트(8)로 연결된 제1로울러(7)의 회전에 따라 상기 인서트(1)를 회전시키도록 구성한 것을 특징으로 하는 인서트내 반도체 자재 자동제거 장치.2. The first roller (7) and the second roller (8) are inserted in the front and rear inner surfaces of the cutouts 6 'of the respective rotary shafts 7' and 8 ', and the predetermined height of the member It is configured to rotate the insert (1) in accordance with the rotation of the first roller (7) connected to the driving unit 9 and the belt 8 in contact with the insert (1) bottom surface protruding into the insert holder (6) Automatic material removal device in the insert. 제1항에 있어서, 상기 인서트 홀더(6)는 상기 인서트(1)최하단 자재수용홀(2)의 측부 수용홀과 대응하는 전면부재 내면상에 센서(25)를 장착하여 대응 수용홀내의 자재유무를 감지하며 이에 따라 상기 제1에어실린더(15)를 제어하는 것을 특징으로 하는 인서트내 반도체자재 자동제거 장치.2. The insert holder (6) according to claim 1, wherein the insert holder (6) mounts the sensor (25) on the inner surface of the front member corresponding to the side accommodating hole (2) of the lowermost material accommodating hole (2). Automatic material removal device in the insert, characterized in that for detecting and thereby controlling the first air cylinder (15). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890017558A 1989-11-30 1989-11-30 Automatic ejector for semiconductor inserter KR920008840B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890017558A KR920008840B1 (en) 1989-11-30 1989-11-30 Automatic ejector for semiconductor inserter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890017558A KR920008840B1 (en) 1989-11-30 1989-11-30 Automatic ejector for semiconductor inserter

Publications (2)

Publication Number Publication Date
KR910010652A true KR910010652A (en) 1991-06-29
KR920008840B1 KR920008840B1 (en) 1992-10-09

Family

ID=19292327

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890017558A KR920008840B1 (en) 1989-11-30 1989-11-30 Automatic ejector for semiconductor inserter

Country Status (1)

Country Link
KR (1) KR920008840B1 (en)

Also Published As

Publication number Publication date
KR920008840B1 (en) 1992-10-09

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