KR910009933U - 리드프레임(Lead Frame) 환원장치 - Google Patents

리드프레임(Lead Frame) 환원장치

Info

Publication number
KR910009933U
KR910009933U KR2019890017868U KR890017868U KR910009933U KR 910009933 U KR910009933 U KR 910009933U KR 2019890017868 U KR2019890017868 U KR 2019890017868U KR 890017868 U KR890017868 U KR 890017868U KR 910009933 U KR910009933 U KR 910009933U
Authority
KR
South Korea
Prior art keywords
lead frame
reduction device
frame reduction
lead
reduction
Prior art date
Application number
KR2019890017868U
Other languages
English (en)
Other versions
KR920007282Y1 (ko
Inventor
김강산
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019890017868U priority Critical patent/KR920007282Y1/ko
Publication of KR910009933U publication Critical patent/KR910009933U/ko
Application granted granted Critical
Publication of KR920007282Y1 publication Critical patent/KR920007282Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
KR2019890017868U 1989-11-30 1989-11-30 리드프레임(Lead Frame) 환원장치 KR920007282Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890017868U KR920007282Y1 (ko) 1989-11-30 1989-11-30 리드프레임(Lead Frame) 환원장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890017868U KR920007282Y1 (ko) 1989-11-30 1989-11-30 리드프레임(Lead Frame) 환원장치

Publications (2)

Publication Number Publication Date
KR910009933U true KR910009933U (ko) 1991-06-29
KR920007282Y1 KR920007282Y1 (ko) 1992-10-09

Family

ID=19292526

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890017868U KR920007282Y1 (ko) 1989-11-30 1989-11-30 리드프레임(Lead Frame) 환원장치

Country Status (1)

Country Link
KR (1) KR920007282Y1 (ko)

Also Published As

Publication number Publication date
KR920007282Y1 (ko) 1992-10-09

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20020918

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee