KR910009491B1 - Flexible circuit lamination - Google Patents

Flexible circuit lamination

Info

Publication number
KR910009491B1
KR910009491B1 KR8504128A KR850004128A KR910009491B1 KR 910009491 B1 KR910009491 B1 KR 910009491B1 KR 8504128 A KR8504128 A KR 8504128A KR 850004128 A KR850004128 A KR 850004128A KR 910009491 B1 KR910009491 B1 KR 910009491B1
Authority
KR
South Korea
Prior art keywords
flexible circuit
circuit lamination
lamination
flexible
circuit
Prior art date
Application number
KR8504128A
Other languages
Korean (ko)
Inventor
Samuel Gazit
Thomas S Nieland
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Application granted granted Critical
Publication of KR910009491B1 publication Critical patent/KR910009491B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0251—Non-conductive microfibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR8504128A 1984-07-09 1985-06-12 Flexible circuit lamination KR910009491B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62916484A 1984-07-09 1984-07-09

Publications (1)

Publication Number Publication Date
KR910009491B1 true KR910009491B1 (en) 1991-11-19

Family

ID=24521865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8504128A KR910009491B1 (en) 1984-07-09 1985-06-12 Flexible circuit lamination

Country Status (5)

Country Link
JP (1) JPS6164448A (en)
KR (1) KR910009491B1 (en)
DE (1) DE3524482A1 (en)
FR (1) FR2569078B1 (en)
GB (1) GB2162124B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4634631A (en) * 1985-07-15 1987-01-06 Rogers Corporation Flexible circuit laminate and method of making the same
JP2501331B2 (en) * 1987-03-14 1996-05-29 松下電工株式会社 Laminate
JPS63224935A (en) * 1987-03-14 1988-09-20 松下電工株式会社 Laminated board
US4869956A (en) * 1987-08-20 1989-09-26 Olin Corporation Polymer/copper laminate and method for fabrication thereof
US4833022A (en) * 1987-08-20 1989-05-23 Olin Corporation Polymer/copper laminate and method for fabrication thereof
WO1989001407A1 (en) * 1987-08-20 1989-02-23 Olin Corporation Novel polymer/metal laminate and method for fabrication thereof
US5055342A (en) * 1990-02-16 1991-10-08 International Business Machines Corporation Fluorinated polymeric composition, fabrication thereof and use thereof
DE69634725T2 (en) * 1995-07-12 2006-01-19 E.I. Du Pont De Nemours And Co., Wilmington IMPROVED LIABILITY OF FLUOROPOLYMERS
SE509570C2 (en) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperature compensating means and procedure for mounting electronics on a circuit board
CN110744839A (en) * 2019-11-01 2020-02-04 中国电子科技集团公司第四十六研究所 Process for preparing composite dielectric plate based on low dielectric constant turning film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
FR2407815A1 (en) * 1977-11-04 1979-06-01 Commissariat Energie Atomique MECHANICALLY FORMABLE COMPOSITE PART, USED IN PARTICULAR FOR THE REALIZATION OF PRINTED CIRCUITS IN THE FORM OF CURVED PLATES
JPS5669245A (en) * 1979-11-07 1981-06-10 Fuji Fiber Glass Kk Product of cut glass filament
JPS57167256A (en) * 1981-04-08 1982-10-15 Hitachi Chemical Co Ltd Heat insulating film
JPS59112099A (en) * 1982-12-15 1984-06-28 日本無機株式会社 Production of glass paper

Also Published As

Publication number Publication date
FR2569078B1 (en) 1988-12-16
GB2162124A (en) 1986-01-29
DE3524482A1 (en) 1986-05-07
FR2569078A1 (en) 1986-02-14
GB2162124B (en) 1988-06-02
GB8517373D0 (en) 1985-08-14
JPS6164448A (en) 1986-04-02

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Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee