KR910004997U - Wafer holding device - Google Patents

Wafer holding device

Info

Publication number
KR910004997U
KR910004997U KR2019890011588U KR890011588U KR910004997U KR 910004997 U KR910004997 U KR 910004997U KR 2019890011588 U KR2019890011588 U KR 2019890011588U KR 890011588 U KR890011588 U KR 890011588U KR 910004997 U KR910004997 U KR 910004997U
Authority
KR
South Korea
Prior art keywords
holding device
wafer holding
wafer
holding
Prior art date
Application number
KR2019890011588U
Other languages
Korean (ko)
Other versions
KR920008710Y1 (en
Inventor
이희준
Original Assignee
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성항공산업 주식회사 filed Critical 삼성항공산업 주식회사
Priority to KR2019890011588U priority Critical patent/KR920008710Y1/en
Publication of KR910004997U publication Critical patent/KR910004997U/en
Application granted granted Critical
Publication of KR920008710Y1 publication Critical patent/KR920008710Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
KR2019890011588U 1989-08-02 1989-08-02 Wafer holding apparatus KR920008710Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890011588U KR920008710Y1 (en) 1989-08-02 1989-08-02 Wafer holding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890011588U KR920008710Y1 (en) 1989-08-02 1989-08-02 Wafer holding apparatus

Publications (2)

Publication Number Publication Date
KR910004997U true KR910004997U (en) 1991-03-20
KR920008710Y1 KR920008710Y1 (en) 1992-12-14

Family

ID=19288932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019890011588U KR920008710Y1 (en) 1989-08-02 1989-08-02 Wafer holding apparatus

Country Status (1)

Country Link
KR (1) KR920008710Y1 (en)

Also Published As

Publication number Publication date
KR920008710Y1 (en) 1992-12-14

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Legal Events

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Payment date: 19991215

Year of fee payment: 8

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