KR910004511B1 - Integrated backplane integrated backplane - Google Patents

Integrated backplane integrated backplane Download PDF

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Publication number
KR910004511B1
KR910004511B1 KR1019860005207A KR860005207A KR910004511B1 KR 910004511 B1 KR910004511 B1 KR 910004511B1 KR 1019860005207 A KR1019860005207 A KR 1019860005207A KR 860005207 A KR860005207 A KR 860005207A KR 910004511 B1 KR910004511 B1 KR 910004511B1
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South Korea
Prior art keywords
power
backplane
logic
etched
bus bar
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KR1019860005207A
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Korean (ko)
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KR870001759A (en
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더블유. 블롬스테드 죤
에스. 요시다 폴
에프. 어빙 웨슬이
로덴코 블라디미르
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허니웰 인포오메이숀 시스템스 인코포레이티드
루이스 피. 엘빈저
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1457—Power distribution arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Power Sources (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electrotherapy Devices (AREA)
  • Patch Boards (AREA)

Abstract

내용 없음.No content.

Description

집적 백플레인(integrated backplane)을 가진 전자시스템Electronic system with an integrated backplane

제 1 도는 집적 백플레인을 포함하는 팩케이징 조립체의 분해 사시도.1 is an exploded perspective view of a packaging assembly including an integrated backplane.

제 2 도는 버스 바아들이 볼트로 부착되어 있는 집적 백플레인을 나타내는 도면.2 shows an integrated backplane with bus bars bolted to it.

제 3 도는 버스 바아들에 볼트로 부착된 코넥터에 전원이 끼워지는 방식을 나타내는 도면.3 shows how the power is fitted to a connector bolted to the bus bars.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

2 : 집적 백플레인 3 : 다층 인쇄 회로판2: integrated backplane 3: multilayer printed circuit board

4 : 인쇄 회로판 조립체 5 : 전압 배전 에치(etch)4 printed circuit board assembly 5 voltage distribution etch

6 : 전원 7 : 접지 에치6: power supply 7: ground etch

8, 10 : 코넥터 12 : 전원 코넥터8, 10: connector 12: power connector

14, 16 : 버스 바아 18 : 가이드14, 16: Bus Bar 18: Guide

20 : 채널 22 : 봉함체20: channel 22: sealing body

25 : 부싱 30 : 메일(male)코넥터25 bushing 30 male connector

32 : 연부코넥터32: Soft connector

본 발명은 전자 조립체의 기계적 팩케이징(packaging)에 관한 것으로, 더 구체적으로는 논리 회로판들과 전원들이 끼워지는 집적 백플레인(배서판)(integrated backplane)의 사용에 관한 것이다.FIELD OF THE INVENTION The present invention relates to mechanical packaging of electronic assemblies, and more particularly to the use of an integrated backplane into which logic circuit boards and power sources are fitted.

전자 시스템, 특히 데이타 처리 시스템은, 선택된 핀들이 백플레인의 표면상의 동(銅) 이치(식각부)(each)에 의해 서로 연결된채 그 백플레인에, 연결부들은 가진 별도의 논리 백플레인을 설치함에 의해 팩케이징 된다. 별도의 전원들이 캐비넷내의 어딘가에 설치되고, 고전류-저전압을 전송하는 무거운 동케이블에 의해 논리 백플레인에 연결된다. 또한, 전원들과 논리 사이의 신호 라인들은 별도의 다도체(다심) 케이블을 요한다. 이러한 종래의 시스템은 모든 전원들을 위한 보호 봉함체를 요하는 것이 보통이다.An electronic system, in particular a data processing system, is packed by installing a separate logical backplane with connections on its backplane, with selected pins connected to each other by an etch on the backplane's surface. Gong is. Separate power supplies are installed somewhere in the cabinet and connected to the logic backplane by heavy copper cables carrying high current-low voltage. In addition, signal lines between the power supplies and the logic require a separate multiconductor (multi-core) cable. Such a conventional system usually requires a protective enclosure for all power sources.

종래 구조의 또 다른 단점은, 전원들이 다중 감지(multiple sensing)의 요구조건에 기인하여 전력 분배를 위해 평행하게 될 수 될 수 없다는 것이다. 다중 감지는, 전원들의 균형된 장하(loading)를 제공하도록 전원들이 논리에는 물론 서로에 제어 신호들을 제공하는 것을 요한다. 긴 와이어는 전자기 간섭신호 및 무선 주파수 간섭 신호들을 제공한다.Another disadvantage of the conventional architecture is that the power supplies cannot be parallel for power distribution due to the requirement of multiple sensing. Multiple sensing requires the power supplies to provide control signals to each other as well as logic to provide a balanced loading of power supplies. Long wires provide electromagnetic and radio frequency interference signals.

따라서, 본 발명의 주 목적은, 개량된 기계적 팩케이징 시스템을 제공하는데 있다. 본 발명의 다른 목적은 전원과 논리 사이에 케이블을 요하지 않는 개량된 시스템을 제공하는데 있다.Accordingly, the main object of the present invention is to provide an improved mechanical packaging system. Another object of the present invention is to provide an improved system that does not require a cable between the power supply and the logic.

본 발명의 또 다른 목적은, 전원과 논리 사이의 전압 강하가 최소로 되게한 개량된 시스템을 제공하는데 있다.It is a further object of the present invention to provide an improved system in which the voltage drop between the power supply and logic is minimized.

본 발명의 또 다른 목적은, 전원들의 병행동작을 제공하는데 있다.Another object of the present invention is to provide a parallel operation of power sources.

본 발명의 또 다른 목적은, 전원과 논리 사이의 신호 라인들을 단축시키는데 있다.Another object of the invention is to shorten the signal lines between the power supply and the logic.

전자 시스템은 집적된 다층 백플레인으로 팩케이징 된다. 논리 인쇄 회로판들 각각은 그 백플레인상에 장착된 각개 코넥터에 끼워진다. 또한, 다중 전원들은 백플레인상에 설치된 결합 코넥터에 끼워지는 전원에 설치된 인쇄 회로판 코넥터에의 신호 라인들을 요한다.The electronic system is packed into an integrated multilayer backplane. Each of the logic printed circuit boards fits into a respective connector mounted on its backplane. In addition, multiple power supplies require signal lines to a printed circuit board connector mounted on a power supply that fits into a mating connector on the backplane.

전압 및 접지가 버스 바아들에 의해 백플레인의 영역들에 배전된다. 특수한 코넥터들이 버스 바아들에 볼트로 연결되어 있고, 전원에 설치된 상응하는 버스 바아들에 맞물린다.Voltage and ground are distributed to the areas of the backplane by bus bars. Special connectors are bolted to the bus bars and engage the corresponding bus bars installed in the power source.

모든 인쇄 회로판들 및 전원들은 단일의 집적 백플레인에 쉽게 끼워질 수 있고 또한 그로부터 쉽게 분리될 수 있다All printed circuit boards and power supplies can easily fit into a single integrated backplane and can be easily separated from it

본 발명의 바람직한 예를 첨부 도면을 참조하여 이하 상세히 설명한다.Preferred examples of the present invention will be described in detail below with reference to the accompanying drawings.

제 1 도에서, 전자 시스템(1)은, 다수의 식각된 인쇄 회로판 조립체들(4)와 전형적으로 4개인(그중 하나가 도시됨) 전원(6)이 끼워지는 집적 백플레인(배전판)(2)를 포함한다.In FIG. 1, the electronic system 1 comprises an integrated backplane (distribution board) 2 into which a plurality of etched printed circuit board assemblies 4 and typically four (one of which is shown) power supply 6 are fitted. It includes.

그 백플레인(2)는 다층 인쇄 회전판(3)을 포함하며, 그 회로판들에 다수의 코넥터들(8)이 장착되고, 그 코넥터들에는 상응하는 인쇄 회로판 조립체들(4)가 끼워진다. 인쇄 회로판(3)에는 또한, 각 전원(6)에 하나씩, 전형적으로 4개의 코넥터(10)이 장착되어 있다.The backplane 2 comprises a multilayer printed turntable 3, on which circuit boards are mounted a number of connectors 8, to which the corresponding printed circuit board assemblies 4 are fitted. The printed circuit board 3 is also equipped with typically four connectors 10, one for each power source 6.

회로판(3)은 각종 코넥터들(8)의 선택된 핀들 사이의 식각된 신호 라인들과, 각종 코넥더(10)의 선택된 핀들 사이의 식각된 신호 라인들, 및 코넥터들(8)과 (10)의 선택된 핀들 사이의 식각된 신호 라인을 포함한다. 또한, 전력이 접지 에치(식각부)(7) 및 전압 배전 에치(5)에 의해, 선택된 핀들에 제공된다.Circuit board 3 includes etched signal lines between selected pins of various connectors 8, etched signal lines between selected pins of various connectors 10, and connectors 8 and 10. An etched signal line between the selected pins of the? In addition, power is provided to the selected pins by the ground etch (etch) 7 and the voltage distribution etch 5.

식각된 라인들은 도면에 도시되어 있지 않는데, 이는 그들의 물리적 제작 및 사용이 본 기술분야에 잘 알려져 있기 때문이다.Etched lines are not shown in the figures because their physical fabrication and use are well known in the art.

전자 시스템(1)은 또한, 백플레인(2)에 부착되고 체널들(20)에 의해 회로판 조립체들(4)에 측방 지지를 제공하는 가이드(18)을 포함한다. 회로판 조립체(4)는 각 코넥터 (8)에 끼워지는 연부 코넥터(9)를 구비하고 있다.The electronic system 1 also includes a guide 18 attached to the backplane 2 and providing lateral support to the circuit board assemblies 4 by channels 20. The circuit board assembly 4 is provided with the edge connector 9 fitted in each connector 8.

봉함체(22)가 전형적으로 4개의 전원들(6)을 보호하고 그 전원들을 위한 측방 지지를 제공한다Enclosure 22 typically protects four power sources 6 and provides lateral support for those power sources.

제 2 도는, 접지를 배전하는 버스 바아(16)과 전압을 배전하는 버스 바아(14)를 나타내는, 백플레인(2)의 외측 저면도이다. 버스 바아(14, 16)은 다수의 부싱(25)에 의해 회로판(3)에 물리적 및 전기적으로 연결되어 있다. 부싱(25)는 제 2a 도에 도시된 바와 같이 각 접지 에치 및 전압 에치에 납땜된다. 버스 바아(14, 16)은 볼트(24)에 의해 부싱(25)에 부착되고, 코넥터(12)가 2개의 볼트(26)에 의해 각 버스 바아에 부착된다.2 is an outer bottom view of the backplane 2 showing the bus bar 16 for distributing ground and the bus bar 14 for distributing voltage. The bus bars 14, 16 are physically and electrically connected to the circuit board 3 by a plurality of bushings 25. Bushing 25 is soldered to each ground etch and voltage etch as shown in FIG. 2A. Bus bars 14, 16 are attached to bushing 25 by bolts 24, and connector 12 is attached to each bus bar by two bolts 26.

제 1 도의 각 전원(6)은, 버스 바아(16) 및 (14)에 각각 접지 및 전압을 제공하기 위해 코넥터들(12)에 끼워지는 접지 및 전압 메일(male) 코넥터들(30)을 가지고 있다. 또한, 연부 코넥터(32)가 코넥터(10)에 끼워져, 전원 제어 논리를 다른 전원(6)이 제어 논리 및 선택된 회로판(4) 제어 논리에 연결된다.Each power supply 6 in FIG. 1 has ground and voltage male connectors 30 that fit into connectors 12 to provide ground and voltage to bus bars 16 and 14, respectively. have. In addition, an edge connector 32 is fitted to the connector 10 so that the power supply control logic is connected to another power supply 6 to the control logic and the selected circuit board 4 control logic.

제 3 도는 볼트(26)에 의해 버스 바아(14) 또는 (16)에 장착된 전원 코넥터(12)의 조립의 세부를 나타낸다. 메일 코넥터(30)이 전원(6)에 부착되어 있고 전원 코넥터(12)에 끼워진다.3 shows details of the assembly of the power connector 12 mounted to the bus bar 14 or 16 by bolts 26. The male connector 30 is attached to the power supply 6 and fitted to the power supply connector 12.

본 발명의 바람직한 예가 도시 및 설명되었다. 당업자는 청구된 발명의 범위내에서 각종 변경 및 개조가 행해질 수 있음을 인식할 수 있는 것이다. 따라서, 전술한 구성요소들중 많은 요소들이, 동일한 효과를 제공하고 청구된 발명의 정신내에 포함되는 다른 요소들로 변경 또는 교체될 수 있다. 따라서, 본 발명의 첨부된 청구 범위에 기재된 바에 따라서만 한정된다.Preferred examples of the invention have been shown and described. Those skilled in the art will recognize that various changes and modifications can be made within the scope of the claimed invention. Accordingly, many of the above components may be changed or replaced with other elements that provide the same effect and are included within the spirit of the claimed invention. Accordingly, it is limited only as described in the appended claims of the present invention.

Claims (2)

전력을 배전하기 위한 다수의 버스 바아 수단, 논리 제어 신호들 및 상기 전력을 배전하기 위한 다수의 제 1 수단, 전력 제어 신호들을 배전하기 위한 다수의 제 2 수단, 및 다수의 백플레인 수단 각각을 상기 전력을 배전하기 위한 상기 다수의 제 1 수단 각각에 연결하기 위한 수단을 포함하며, 다수의 버스 바아 수단 각각이 전력을 받기 위한 제 3 수단을 가지는, 제어 신호를 및 전력 신호들을 배전하기 위한 집적 백플레인 수단과 ; 상기 버스 바아 수단에 전력을 제공하기 위한 상기 제 3 수단에 연결된 제 4 수단과, 상기 전력 제어 신호를 배전하기 위한 상기 제 2 수단에 연결된 제 5 수단을 각각 가진 다수의 전원수단 ; 및 다수의 논리소자들을 장착하여 그 논리소자들을, 상기 논리 제어 신호와 전력 제어 신호들을 송수신하고 상기 전력을 받기위한 상기 다수의 제 1 수단들중 하나에 각각 연결된 제 6 수단에 전기적으로 연결하는 다수의 논리 회로판 수단을 포함하는 단일 백플레인을 가진 전자 시스템.Each of the plurality of bus bar means for power distribution, logic control signals and a plurality of first means for power distribution, a plurality of second means for power distribution control signals, and a plurality of backplane means Means for connecting to each of said plurality of first means for power distribution, wherein each of said plurality of bus bar means has a third means for receiving power, and an integrated backplane means for power control and power signal distribution. And; A plurality of power supply means each having a fourth means connected to the third means for providing power to the bus bar means and a fifth means connected to the second means for distributing the power control signal; And a plurality of logic elements mounted to the plurality of logic elements to electrically connect the logic elements to a sixth means each connected to one of the plurality of first means for transmitting and receiving the logic control and power control signals and receiving the power. An electronic system having a single backplane comprising logic circuit board means. 제 1 항에 있어서, 상기 집적 백플레인 수단이, 식각된 논리 제어 라인들, 및 식각된 전력 제어 라인들, 및 식각된 전력 라인들을 가진 단일의 판을 포함하고 ; 상기 연결수단이, 체결수단을 각각 가지며 상기 식각된 전력 라인중 하나에 각각 납땜된 다수의 부싱들을 포함하고 ; 상기 다수의 버스 바아 수단이, 상기 체결수단에 의해 상기 다수의 부싱들중 선택된 것들에 각각 연결되어 있는 전자 시스템.2. The apparatus of claim 1, wherein the integrated backplane means comprises a single plate with etched logic control lines, etched power control lines, and etched power lines; The connecting means comprises a plurality of bushings each having fastening means and each soldered to one of the etched power lines; And the plurality of bus bar means are each connected to selected ones of the plurality of bushings by the fastening means.
KR1019860005207A 1985-07-01 1986-06-28 Integrated backplane integrated backplane KR910004511B1 (en)

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US06/750,441 US4685032A (en) 1985-07-01 1985-07-01 Integrated backplane

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JPS6231197A (en) 1987-02-10
EP0207496B1 (en) 1992-04-22
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KR870001759A (en) 1987-03-17
FI862700A0 (en) 1986-06-25
FI90812B (en) 1993-12-15
EP0207496A2 (en) 1987-01-07
RU2013897C1 (en) 1994-05-30
AU593263B2 (en) 1990-02-08
CA1266116A (en) 1990-02-20
NO172020C (en) 1993-05-26
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EP0207496A3 (en) 1987-10-14
NO172020B (en) 1993-02-15
ES8800565A1 (en) 1987-11-01
PT82894A (en) 1986-08-01
DE3684963D1 (en) 1992-05-27
ES556759A0 (en) 1987-11-01
BR8603002A (en) 1987-02-17
YU46408B (en) 1993-10-20
US4685032A (en) 1987-08-04
NO862637L (en) 1987-01-02
PT82894B (en) 1992-09-30
CN1005958B (en) 1989-11-29
MX164087B (en) 1992-07-15
AU5941086A (en) 1987-01-08
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CN86105713A (en) 1987-02-25
FI90812C (en) 1994-03-25

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