KR910004291A - Soldering Machine with Hot Air - Google Patents

Soldering Machine with Hot Air Download PDF

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Publication number
KR910004291A
KR910004291A KR1019890011485A KR890011485A KR910004291A KR 910004291 A KR910004291 A KR 910004291A KR 1019890011485 A KR1019890011485 A KR 1019890011485A KR 890011485 A KR890011485 A KR 890011485A KR 910004291 A KR910004291 A KR 910004291A
Authority
KR
South Korea
Prior art keywords
hot air
blower
main body
air heater
soldering machine
Prior art date
Application number
KR1019890011485A
Other languages
Korean (ko)
Other versions
KR0121186B1 (en
Inventor
박웅기
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019890011485A priority Critical patent/KR0121186B1/en
Publication of KR910004291A publication Critical patent/KR910004291A/en
Application granted granted Critical
Publication of KR0121186B1 publication Critical patent/KR0121186B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

내용 없음.No content.

Description

열풍장치를 구비한 납땜기Soldering Machine with Hot Air

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 납땜기의 사시도,1 is a perspective view of a soldering machine according to the present invention,

제2도는 본 발명에 의한 납땜기의 내부 구성을 보인 개략도.2 is a schematic view showing an internal configuration of a soldering machine according to the present invention.

Claims (1)

내부에 송풍기(2)가 장착되는 본체(1)와, 통상의 납땜 장치(5)가 고정되는 손잡이(3)와, 상기 납땜 장치(5)에 지지되는 열풍가열기(7)와, 상기 본체(1)와 손잡이(3)를 연결하는 피복선(4)의 내부에 장착되어 송풍기(2)로 흡입된 공기를 열풍가열기(7)로 공급하는 송풍관(8)과, 상기 열풍가열기(7)의 선단부에 설치되는 송풍공(10a)을 구비한 송풍구(10)와, 상기 본체(1)에 설치되어 상기 납땜장치(5), 숭풍기(2) 및 열풍가열기(7)를 각각 구동시키는 납땜스위치(11) 및 열풍가열스위치(12)로 구성됨을 특징으로 하는 열풍장치를 구비한 닙땜기.The main body 1 to which the blower 2 is mounted inside, the handle 3 to which the conventional soldering apparatus 5 is fixed, the hot air heater 7 supported by the soldering apparatus 5, and the said main body ( 1) a blower tube (8) mounted inside the sheath line (4) connecting the handle (3) to the hot air heater (7) for supplying air sucked into the blower (2), and a tip of the hot air heater (7). A blower opening 10 having a blower hole 10a installed in the main body 1, and a soldering switch installed in the main body 1 to drive the soldering apparatus 5, the wind blower 2, and the hot air heater 7 respectively; And a hot air heating switch (12). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890011485A 1989-08-11 1989-08-11 Solder device required document a hot blast equipment KR0121186B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019890011485A KR0121186B1 (en) 1989-08-11 1989-08-11 Solder device required document a hot blast equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019890011485A KR0121186B1 (en) 1989-08-11 1989-08-11 Solder device required document a hot blast equipment

Publications (2)

Publication Number Publication Date
KR910004291A true KR910004291A (en) 1991-03-28
KR0121186B1 KR0121186B1 (en) 1997-11-10

Family

ID=19288864

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890011485A KR0121186B1 (en) 1989-08-11 1989-08-11 Solder device required document a hot blast equipment

Country Status (1)

Country Link
KR (1) KR0121186B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117697260A (en) * 2024-02-02 2024-03-15 国网山东省电力公司莱芜供电公司 Block terminal box welding set that power supply was used

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200453591Y1 (en) * 2010-10-06 2011-05-17 임채열 Rework hot air device for SMD
KR101337729B1 (en) * 2011-12-29 2013-12-06 손만호 Box type kit for soldering

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117697260A (en) * 2024-02-02 2024-03-15 国网山东省电力公司莱芜供电公司 Block terminal box welding set that power supply was used

Also Published As

Publication number Publication date
KR0121186B1 (en) 1997-11-10

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