KR910002493B1 - Method of stripping electrolytically deposited copper from a cathode - Google Patents

Abstract

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Description

Electrolytic deposition of copper from cathode

FIG. 1 shows one step of a bending operation embodying the present invention. FIG.

Fig. 2 shows another step of the bending operation. Fig.

Figure 3 shows one step in the wedge peeling operation embodying the present invention;

4 shows another step of the wedge peeling operation; Fig.

DESCRIPTION OF THE REFERENCE NUMERALS

1: cathode 2, 3: copper deposit

4: Hanger bar 5: Support structure

6, 7, 8, 9: bar 10, 11: hydraulic ram

13: Wedge

The present invention relates to a method for peeling electrolytically deposited copper from a negative electrode used in an electrolytic cell.

Although the present invention is applicable to such cathodes, it will be described with reference to cathodes described in Australian Patent No. 506,521. In that patent, the cathode is a stainless steel starter plate that fits within an electrolytic cell and accumulates copper growth deposits on both sides when connected to a power source.

In the prior art, the copper deposit on the sides of the upper end of the plate after the cathode is removed from the electrolytic bath is beaten with an air passive hammer. This pulling causes the copper deposits in the local part to be partially separated from the plate. The remainder of the copper deposit is then removed by use of an air nozzle blower.

The hammer action is not only loud but also has the disadvantage of twisting the stainless steel cathode tube over a predetermined period of time.

The present invention is directed to a method of manufacturing a copper foil which bends the negative electrode in an amount that supports the negative electrode along its lower edge and exceeds the strength of the adhesive bond between the deposited copper and the negative electrode but does not exceed the elastic limit of the negative electrode, Separating at least a portion of the copper from the negative electrode and wedge peeling or gas blowing the copper deposited from the negative electrode, the method comprising peeling the electrolytically deposited copper from the negative electrode.

The present invention will now be described by way of example with reference to the accompanying drawings.

Electrolytic deposition of copper on a stainless steel cathode plate occurs while the plate is immersed in the electrolytic bath. The plate hanging from the hanger bar hangs on the conductive rail on the electrolytic cell. The purpose of electrolysis is to electrochemically refine copper by accepting copper ions from an impurity copper anode suspended in an electrolytic cell or to electrically obtain copper ions from an electrolytic bath in which the copper is dissolved and contains an inert or insoluble anode such as lead or lead alloy .

As the electrolysis progresses, the copper layer is deposited on each side of the stainless steel cathode plate. After a certain period of time, the layer of copper increases to a thickness that is desired to be removed.

Referring now to FIG. 1, a stainless steel cathode plate 1 with copper deposits 2, 3 is removed from an electrolytic bath (not shown) and passes through a stripped area. The negative electrode 1 is supported on the bottom edge by the support structure 5 and not suspended from the hanger bar 4 at the peeled portion and the pair of upper reaction bars 6 and 7 and the pair of lower reaction bars 8, 9). Preferably, the cathode can be horizontally moved over a series of rollers on the surface of the support structure 5. The reaction bars 6, 7 support the uncoated ends of the cathodes, while the bars 8, 9 support the covered ends.

By preventing the plate from hanging from the hanger bar 4 during the peeling operation, wear of the copper-plated electrical contact end is prevented. Since the bottom edge of the negative plate is covered with wax, wear of the bottom edge before the plate is reused is not relevant.

Preferably, the middle portion of the cathode 1 is pressed by one of the pair of hydraulic rams 10, 11 until the cathode is bent. The head of the ram can make point contact, line contact or face contact with the plate. The hydraulic ram 10 allows the center of the negative electrode 1 to flex sufficiently to exceed the adhesive bond strength of the copper deposit 2 separated from at least the upper portion of the stainless steel plate in the region 12 as shown.

Also preferably, as shown in FIG. 2, the other one of the pair of hydraulic rams 11 bends the negative electrode 1 in the opposite direction so as to displace the copper deposit 3 from the other side of the negative electrode do.

It also makes it possible to separate the deposits 2, 3 from each other only in one direction.

Further, when the cathode 1 is transported, the upper and lower ends of the cathode are moved horizontally so that a series of rollers for bending the cathode when they are combined by a series of rollers positioned in contact in the vicinity of the middle portion of the cathode Lt; / RTI > It is understood that many different ways of bending cathodes are possible and all fall within the scope of the present invention.

When the edge of the upper part of the copper deposits 2, 3 is separated from the cathode 1, the wedge 13 as shown in FIG. 3 is used to separate each of the copper deposits 2, 3, ) And the cathode (1). Then the copper falls into the collection box. FIG. 4 shows the final step of peeling the wedge 13 at the bottom of the cathode 1. This can be accomplished by the use of air or other gas blown from the nozzles.

Preferably the hydraulic cylinders on both sides of the cathode are operated in such a way that they can deflect the cathode over a range of 20 to 30 mm in each direction by pressing at the center. This is sufficient to separate or strip copper downward from the cathode to the point where the hydraulic ram presses. The fact that this release at the top of the cathode is more certain than in the prior art allows the hydraulically actuated wedge to be introduced over the partially released copper growth to promote the complete stripping action. As a result, the average peel rate can be significantly accelerated. Currently, the ratio is peeled off one sheet every 6 seconds on average.

As will be understood by those skilled in the art, the present invention can be performed when the cathode is held in any other position than the vertical.

Claims (7)

Bending the negative electrode (1) along its lower edge; bending the negative electrode in an amount exceeding the adhesive bond strength between the deposited copper (2,3) and the negative electrode but not exceeding the elastic limit of the negative electrode Separating at least a portion of the deposited copper from the negative electrode, and wedging or gas blowing the copper deposited from the negative electrode. A method according to claim 1, wherein the cathode (1) is bent in only one direction. The method of claim 1, wherein the cathode (1) is bent in one direction and then bent in the opposite direction. The electrolytic deposition copper peeling method according to claim 2 or 3, characterized in that the negative electrode (1) is bent by hydraulic rams (10, 11) making point contact, line contact or surface contact with the negative electrode . 5. A device according to claim 4, characterized in that the cathode (1) is held vertically by two pairs of reaction bars, while a pair (8,9) is arranged on either side of the cathode in the vicinity of the lower edge (5) 7) is located on the other side of the cathode in the vicinity of its upper edge (4). 6. A method according to claim 5, wherein the cathode (1) is made of stainless steel. The method of separating electrolytic deposition copper from a negative electrode according to claim 6, wherein the negative electrode (1) is a stainless steel plate.

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