KR910001989A - Solid state imaging device - Google Patents

Solid state imaging device Download PDF

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Publication number
KR910001989A
KR910001989A KR1019900008747A KR900008747A KR910001989A KR 910001989 A KR910001989 A KR 910001989A KR 1019900008747 A KR1019900008747 A KR 1019900008747A KR 900008747 A KR900008747 A KR 900008747A KR 910001989 A KR910001989 A KR 910001989A
Authority
KR
South Korea
Prior art keywords
state imaging
package
imaging device
reference plate
solid
Prior art date
Application number
KR1019900008747A
Other languages
Korean (ko)
Other versions
KR930006986B1 (en
Inventor
히로노부 아베
마사히코 카도와끼
토시오 나까오
히데아끼 아베
아끼야 이즈미
쯔네히사 호리우찌
요시노리 닛따
Original Assignee
미따 가쯔시게
가부시기가이샤 히다찌세이사구쇼
타케이 유끼오
히다찌디바이스 엔지니어링 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미따 가쯔시게, 가부시기가이샤 히다찌세이사구쇼, 타케이 유끼오, 히다찌디바이스 엔지니어링 가부시기가이샤 filed Critical 미따 가쯔시게
Publication of KR910001989A publication Critical patent/KR910001989A/en
Application granted granted Critical
Publication of KR930006986B1 publication Critical patent/KR930006986B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]

Abstract

내용 없음No content

Description

고체촬상장치Solid state imaging device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 의한 고체촬상장치의 특징 부분을 표시한 상면도.1 is a top view showing a characteristic portion of the solid state imaging device according to the present invention.

제2A도 및 제2B도는 본 발명에 의한 고체 촬상장치에 사용되는 리이드 프레임의 프레스 성형전과 후의 상태를 표시한 평면도.2A and 2B are plan views showing states before and after press molding of the lead frame used in the solid-state imaging device according to the present invention.

Claims (2)

고체촬상칩과, 이 칩을 수납하는 패키지와, 이 패키지의 속에서 상기 칩에 전기적으로 접속된 복수의 내부리이드와, 이 내부리이드에 연속해서 형성되고 상기 패키지로 부터 노출하는 복수의 외부리이드와, 상기 패키지의 속과 밖에 위치하여 잘라진 부분이 형성된 기준판을 구비하여 이루어지고, 상기 내부리이드에는 Al막이 피복되어서 이루어지고, 상기 패키지로부터 노출하는 부분의 상기 기준판 및 상기 외부리이드에는 Al막을 개재하는 것을 없게하여 Sn막이 피복되어서 이루어지는 것을 특징으로 하는 고체촬상장치.A solid-state imaging chip, a package for accommodating the chip, a plurality of inner leads electrically connected to the chip in the package, a plurality of outer leads continuously formed on the inner leads and exposed from the package; And a reference plate having cut portions positioned inside and outside the package, wherein the inner lead is covered with an Al film, and the reference plate and the outer lead of the portion exposed from the package are interposed with an Al film. A solid-state imaging device, characterized in that the Sn film is coated so as not to. 제1항에 있어서, 상기 기준판은 제1및 제2의 기준판으로 이루어지고, 상기 제1의 기준판의 상기 잘라진 부분은 원호부분을 가지고, 상기 제2의 기준판의 상기 잘라진 부분은 거의 평행의 2개의 직선부분을 가진 것을 특징으로 하는 고체촬상소자.2. The apparatus of claim 1, wherein the reference plate consists of first and second reference plates, wherein the cut portion of the first reference plate has an arc portion, and the cut portion of the second reference plate is substantially A solid-state imaging device having two straight portions in parallel. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900008747A 1989-06-14 1990-06-14 Solide state imager KR930006986B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-149689 1989-06-14
JP14968989 1989-06-14
JP01-149689 1989-06-14

Publications (2)

Publication Number Publication Date
KR910001989A true KR910001989A (en) 1991-01-31
KR930006986B1 KR930006986B1 (en) 1993-07-24

Family

ID=15480659

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900008747A KR930006986B1 (en) 1989-06-14 1990-06-14 Solide state imager

Country Status (2)

Country Link
JP (1) JPH0394466A (en)
KR (1) KR930006986B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001257330A (en) * 2000-03-09 2001-09-21 Sony Corp Solid-state imaging device
JP2003007880A (en) * 2001-06-20 2003-01-10 Sony Corp Hollow package and manufacturing method therefor

Also Published As

Publication number Publication date
KR930006986B1 (en) 1993-07-24
JPH0394466A (en) 1991-04-19

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