KR910001451A - Positive type photoresist composition - Google Patents

Abstract

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Description

Positive type photoresist composition

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Claims (9)

A positive type photoresist composition comprising an alkali-soluble resin, a sensitizer having an orthoquinone diazido group, and a solvent containing a diester of glycol represented by the following general formula (I) and having a total carbon atom number of 10 or less; Wherein R ¹ , R ² , R ³ and R ⁴ represent a hydrogen atom, a methyl group or an ethyl group, which may be the same or different from each other and n is 0,1 or 2. The method of claim 1, wherein the solvent is a mixture of 60 to 99% by weight of the diester of the glycol represented by the general formula (I) and having a total carbon atom of 10 or less and 40 to 1% by weight of the organic solvent having a boiling point of 50 to 140 ° C. Positive type photoresist composition that is a solvent. 3. The diester of the glycol according to claim 1 or 2, wherein the glycol represented by the general formula (I) and having a total carbon atom of 10 or less is ethylene glycol diacetate, ethylene glycol diformate, ethylene glycol dipropionate, propylene glycol A positive type photoresist composition wherein at least one is selected from the group consisting of diacetate, propylene glycol dipropionate, butanediol diacetate and butanediol dipropionate. The positive type photoresist composition according to claim 1, wherein the organic solvent having a boiling point of 50 to 140 ° C. is selected from at least one group consisting of kezone, carboxylate, carbonate, ether and alcohol. The method of claim 4, wherein the organic solvent is acetone, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate, dimethyl carbonate, diethyl carbonate, methanol, ethanol, propanol, butanol, metha Positive type photoresist composition which is oxy propanol, ethoxy propanol, detrahydrofuran, dioxane, propylene glycol monomethyl ether. The positive type photoresist composition of claim 1, wherein the alkali-soluble resin is selected from the group consisting of noblock resins, polyhydroxystyrenes and derivatives thereof, and styrene-maleic anhydride copolymers. The method of claim 1, wherein the sensitizer is 1,2-naphthoquinone diazido-5-sulfonic acid, 1,2-naphthoquinone diazido-4-sulfonic acid and 1,2-benzoquinone diazido-4-sulfonic acid Positive type photoresist composition, which is an ester or amide of one selected from the group consisting of: The positive type photoresist composition of claim 1, wherein the ratio of the alkali-soluble resin to the sensitizer is 100: 5 to 100% by weight. The positive type photoresist composition according to claim 1, wherein the concentration of the alkali-soluble resin and the sensitizer in the composition is 3 to 50% by weight. ※ Note: The disclosure is based on the initial application.